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集成电路中的空间定位技术——红外显微镜方法

Spatial Location in Integrated Circuits through Infrared Microscopy.

机构信息

Laboratoire d'Informatique et Systemes, Aix-Marseille University, 163 Avenue de Luminy, 13288 CEDEX 09 Marseille, France.

STMicroelectronics, 190 Avenue Coq, 13106 Rousset, France.

出版信息

Sensors (Basel). 2021 Mar 20;21(6):2175. doi: 10.3390/s21062175.

DOI:10.3390/s21062175
PMID:33804619
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC8003807/
Abstract

In this paper, we present an infrared microscopy based approach for structures' location in integrated circuits, to automate their secure characterization. The use of an infrared sensor is the key device for internal integrated circuit inspection. Two main issues are addressed. The first concerns the scan of integrated circuits using a motorized optical system composed of an infrared uncooled camera combined with an optical microscope. An automated system is required to focus the conductive tracks under the silicon layer. It is solved by an autofocus system analyzing the infrared images through a discrete polynomial image transform which allows an accurate features detection to build a focus metric robust against specific image degradation inherent to the acquisition context. The second issue concerns the location of structures to be characterized on the conductive tracks. Dealing with a large amount of redundancy and noise, a graph-matching method is presented-discriminating graph labels are developed to overcome the redundancy, while a flexible assignment optimizer solves the inexact matching arising from noises on graphs. The resulting automated location system brings reproducibility for secure characterization of integrated systems, besides accuracy and time speed increase.

摘要

在本文中,我们提出了一种基于红外显微镜的集成电路结构定位方法,以实现其安全特征化的自动化。使用红外传感器是进行内部集成电路检查的关键设备。我们解决了两个主要问题。第一个问题涉及使用由非制冷红外摄像机与光学显微镜组合而成的电动光学系统对集成电路进行扫描。需要一个自动化系统来聚焦硅层下的导电轨道。我们通过离散多项式图像变换分析红外图像的自动对焦系统来解决这个问题,该系统允许对特征进行精确检测,从而构建一个对固有于采集上下文的特定图像降质具有鲁棒性的对焦度量。第二个问题涉及到要在导电轨道上定位的结构的位置。针对大量冗余和噪声,我们提出了一种图匹配方法——通过开发判别图标签来克服冗余,同时使用灵活的分配优化器解决来自图上噪声的不精确匹配。所得到的自动化定位系统为集成电路系统的安全特征化提供了可重复性,同时提高了准确性和速度。

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An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection.集成电路封装检测的无损检测方法概述。
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All-optical microscope autofocus based on an electrically tunable lens and a totally internally reflected IR laser.基于电可调透镜和全内反射红外激光的全光学显微镜自动对焦。
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Pattern recognition with machine learning on optical microscopy images of typical metallurgical microstructures.基于机器学习的光学显微镜典型金相组织图像模式识别。
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