Li Xinxin, Wang Yimeng, Guan Yingchun
School of Mechanical Engineering and Automation, Beihang University, 37 Xueyuan Road, Beijing 100083, China.
National Engineering Laboratory of Additive Manufacturing for Large Metallic Components, Beihang University, 37 Xueyuan Road, Beijing 100083, China.
Micromachines (Basel). 2021 Mar 4;12(3):262. doi: 10.3390/mi12030262.
In this paper, we first report the laser grinding method for a single-crystal silicon wafer machined by diamond sawing. 3D laser scanning confocal microscope (LSCM), X-ray diffraction (XRD), scanning electron microscope (SEM), X-ray photoelectron spectroscopy (XPS), laser micro-Raman spectroscopy were utilized to characterize the surface quality of laser-grinded Si. Results show that SiO layer derived from mechanical machining process has been efficiently removed after laser grinding. Surface roughness Ra has been reduced from original 400 nm to 75 nm. No obvious damages such as micro-cracks or micro-holes have been observed at the laser-grinded surface. In addition, laser grinding causes little effect on the resistivity of single-crystal silicon wafer. The insights obtained in this study provide a facile method for laser grinding silicon wafer to realize highly efficient grinding on demand.
