Zhao Yuchao, Ye Nan, Zhuo Haiou, Wei Chaolong, Zhou Weiwei, Mao Jie, Tang Jiancheng
School of Materials Science and Engineering, Nanchang University, No. 999, Xuefu Avenue, Nanchang 330031, China.
Materials (Basel). 2021 Mar 5;14(5):1233. doi: 10.3390/ma14051233.
Tungsten-copper (W-Cu) composites are widely used as electrical contact materials, resistance welding, electrical discharge machining (EDM), and plasma electrode materials due to their excellent arc erosion resistance, fusion welding resistance, high strength, and superior hardness. However, the traditional preparation methods pay little attention to the compactness and microstructural uniformity of W-Cu composites. Herein, W-Cu composite coatings are prepared by pulse electroplating using nano-W powder as raw material and the influence of forward-reverse duty cycle of pulse current on the structure and mechanical properties is systematically investigated. Moreover, the densification mechanism of the W-Cu composite coating is analyzed from the viewpoints of forward-pulse plating and reverse-pulse plating. At the current density () of 2 A/dm, frequency () of 1500 Hz, forward duty cycle () of 40% and reverse duty cycle () of 10%, the W-Cu composite coating rendered a uniform microstructure and compact structure, resulting in a hardness of 127 HV and electrical conductivity of 53.7 MS/m.
钨铜(W-Cu)复合材料因其优异的抗电弧侵蚀性、抗熔焊性、高强度和高硬度,被广泛用作电接触材料、电阻焊接、电火花加工(EDM)和等离子体电极材料。然而,传统的制备方法很少关注W-Cu复合材料的致密性和微观结构均匀性。在此,以纳米W粉为原料,通过脉冲电镀制备W-Cu复合涂层,并系统研究脉冲电流的正向-反向占空比对其结构和力学性能的影响。此外,从正向脉冲电镀和反向脉冲电镀的角度分析了W-Cu复合涂层的致密化机制。在电流密度()为2 A/dm、频率()为1500 Hz、正向占空比()为40%和反向占空比()为10%时,W-Cu复合涂层呈现出均匀的微观结构和致密的结构,硬度为127 HV,电导率为53.7 MS/m。