• 文献检索
  • 文档翻译
  • 深度研究
  • 学术资讯
  • Suppr Zotero 插件Zotero 插件
  • 邀请有礼
  • 套餐&价格
  • 历史记录
应用&插件
Suppr Zotero 插件Zotero 插件浏览器插件Mac 客户端Windows 客户端微信小程序
定价
高级版会员购买积分包购买API积分包
服务
文献检索文档翻译深度研究API 文档MCP 服务
关于我们
关于 Suppr公司介绍联系我们用户协议隐私条款
关注我们

Suppr 超能文献

核心技术专利：CN118964589B侵权必究
粤ICP备2023148730 号-1Suppr @ 2026

文献检索

告别复杂PubMed语法，用中文像聊天一样搜索，搜遍4000万医学文献。AI智能推荐，让科研检索更轻松。

立即免费搜索

文件翻译

保留排版，准确专业，支持PDF/Word/PPT等文件格式，支持 12+语言互译。

免费翻译文档

深度研究

AI帮你快速写综述，25分钟生成高质量综述，智能提取关键信息，辅助科研写作。

立即免费体验

脉冲电流正向-反向占空比对电镀W-Cu复合涂层结构和性能的影响

Influence of Pulse Current Forward-Reverse Duty Cycle on Structure and Performance of Electroplated W-Cu Composite Coatings.

作者信息

Zhao Yuchao, Ye Nan, Zhuo Haiou, Wei Chaolong, Zhou Weiwei, Mao Jie, Tang Jiancheng

机构信息

School of Materials Science and Engineering, Nanchang University, No. 999, Xuefu Avenue, Nanchang 330031, China.

出版信息

Materials (Basel). 2021 Mar 5;14(5):1233. doi: 10.3390/ma14051233.

DOI:10.3390/ma14051233
PMID:33807901
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC7961998/
Abstract

Tungsten-copper (W-Cu) composites are widely used as electrical contact materials, resistance welding, electrical discharge machining (EDM), and plasma electrode materials due to their excellent arc erosion resistance, fusion welding resistance, high strength, and superior hardness. However, the traditional preparation methods pay little attention to the compactness and microstructural uniformity of W-Cu composites. Herein, W-Cu composite coatings are prepared by pulse electroplating using nano-W powder as raw material and the influence of forward-reverse duty cycle of pulse current on the structure and mechanical properties is systematically investigated. Moreover, the densification mechanism of the W-Cu composite coating is analyzed from the viewpoints of forward-pulse plating and reverse-pulse plating. At the current density () of 2 A/dm, frequency () of 1500 Hz, forward duty cycle () of 40% and reverse duty cycle () of 10%, the W-Cu composite coating rendered a uniform microstructure and compact structure, resulting in a hardness of 127 HV and electrical conductivity of 53.7 MS/m.

摘要

钨铜（W-Cu）复合材料因其优异的抗电弧侵蚀性、抗熔焊性、高强度和高硬度，被广泛用作电接触材料、电阻焊接、电火花加工（EDM）和等离子体电极材料。然而，传统的制备方法很少关注W-Cu复合材料的致密性和微观结构均匀性。在此，以纳米W粉为原料，通过脉冲电镀制备W-Cu复合涂层，并系统研究脉冲电流的正向-反向占空比对其结构和力学性能的影响。此外，从正向脉冲电镀和反向脉冲电镀的角度分析了W-Cu复合涂层的致密化机制。在电流密度（）为2 A/dm、频率（）为1500 Hz、正向占空比（）为40%和反向占空比（）为10%时，W-Cu复合涂层呈现出均匀的微观结构和致密的结构，硬度为127 HV，电导率为53.7 MS/m。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9a46/7961998/d57ee3e846e9/materials-14-01233-g012.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9a46/7961998/a52a5d078daa/materials-14-01233-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9a46/7961998/34fd5eca3f9b/materials-14-01233-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9a46/7961998/f087b159c17b/materials-14-01233-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9a46/7961998/aa3950f52134/materials-14-01233-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9a46/7961998/22bc52b253c6/materials-14-01233-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9a46/7961998/98e77fd62cae/materials-14-01233-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9a46/7961998/d238cc732269/materials-14-01233-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9a46/7961998/05320ce0d4c4/materials-14-01233-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9a46/7961998/0cd9113b1a79/materials-14-01233-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9a46/7961998/7b129cc29e89/materials-14-01233-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9a46/7961998/b94f7177ac18/materials-14-01233-g011.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9a46/7961998/d57ee3e846e9/materials-14-01233-g012.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9a46/7961998/a52a5d078daa/materials-14-01233-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9a46/7961998/34fd5eca3f9b/materials-14-01233-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9a46/7961998/f087b159c17b/materials-14-01233-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9a46/7961998/aa3950f52134/materials-14-01233-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9a46/7961998/22bc52b253c6/materials-14-01233-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9a46/7961998/98e77fd62cae/materials-14-01233-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9a46/7961998/d238cc732269/materials-14-01233-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9a46/7961998/05320ce0d4c4/materials-14-01233-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9a46/7961998/0cd9113b1a79/materials-14-01233-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9a46/7961998/7b129cc29e89/materials-14-01233-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9a46/7961998/b94f7177ac18/materials-14-01233-g011.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/9a46/7961998/d57ee3e846e9/materials-14-01233-g012.jpg

相似文献

1
Influence of Pulse Current Forward-Reverse Duty Cycle on Structure and Performance of Electroplated W-Cu Composite Coatings.脉冲电流正向-反向占空比对电镀W-Cu复合涂层结构和性能的影响
Materials (Basel). 2021 Mar 5;14(5):1233. doi: 10.3390/ma14051233.
2
Study on Pulse-Reverse Electroplating Process for the Manufacturing of a Graphene-Based Coating.用于制造石墨烯基涂层的脉冲反向电镀工艺研究
Materials (Basel). 2023 Jan 16;16(2):854. doi: 10.3390/ma16020854.
3
Effect of Nano Copper on the Densification of Spark Plasma Sintered W-Cu Composites.纳米铜对放电等离子烧结W-Cu复合材料致密化的影响。
Nanomaterials (Basel). 2021 Feb 5;11(2):413. doi: 10.3390/nano11020413.
4
Co-electrodeposition of hard Ni-W/diamond nanocomposite coatings.硬态镍钨/金刚石纳米复合涂层的共电沉积
Sci Rep. 2016 Feb 29;6:22285. doi: 10.1038/srep22285.
5
Engineering performance of tungsten network reinforced copper matrix composites synthesized by selective laser melting and infiltration.选择性激光熔化与熔渗法制备的钨网增强铜基复合材料的工程性能
Sci Technol Adv Mater. 2024 Jan 26;25(1):2309888. doi: 10.1080/14686996.2024.2309888. eCollection 2024.
6
Effect of Pulse Electrodeposition Parameters on the Microstructure and Mechanical Properties of Ni-W/B Nanocomposite Coatings.脉冲电沉积参数对Ni-W/B纳米复合涂层微观结构及力学性能的影响
Nanomaterials (Basel). 2022 May 30;12(11):1871. doi: 10.3390/nano12111871.
7
Wear Resistance Properties Reinforcement Using Nano-Al/Cu Composite Coating in Sliding Bearing Maintenance.滑动轴承维修中使用纳米铝/铜复合涂层增强耐磨性能
J Nanosci Nanotechnol. 2018 Mar 1;18(3):2152-2157. doi: 10.1166/jnn.2018.14285.
8
Laser Powder Bed Fusion of Copper-Tungsten Powders Manufactured by Milling or Co-Injection Atomization Process.通过研磨或共注射雾化工艺制造的铜钨粉末的激光粉末床熔融
Materials (Basel). 2024 Sep 6;17(17):4394. doi: 10.3390/ma17174394.
9
Analysis of the Influence of Starting Materials and Processing Conditions on the Properties of W/Cu Alloys.起始材料和加工条件对W/Cu合金性能的影响分析
Materials (Basel). 2017 Feb 8;10(2):142. doi: 10.3390/ma10020142.
10
Morphology Control and Mechanism of Different Bath Systems in Cu/SiCw Composite Electroplating.铜/碳化硅晶须复合电镀中不同镀液体系的形貌控制及机理
Nanomaterials (Basel). 2024 Jun 18;14(12):1043. doi: 10.3390/nano14121043.

引用本文的文献

1
Analysis of EDM Performance, through a Thermal-Electrical Model with a Trunk-Conical Discharge Channel, Using a Steel Tool and an Aluminium Workpiece.使用钢刀具和铝工件，通过具有树干锥形放电通道的热电模型分析电火花加工性能。
Materials (Basel). 2021 Jun 3;14(11):3038. doi: 10.3390/ma14113038.

本文引用的文献

1
Synergistic enhancing effect for mechanical and electrical properties of tungsten copper composites using spark plasma infiltrating sintering of copper-coated graphene.利用铜包覆石墨烯的放电等离子体浸渗烧结对钨铜复合材料的机械和电学性能产生协同增强作用。
Sci Rep. 2017 Dec 19;7(1):17836. doi: 10.1038/s41598-017-18114-2.
2
The Influence of Pulsed Electroplating Frequency and Duty Cycle on Copper Film Microstructure and Stress State.脉冲电镀频率和占空比对铜膜微观结构及应力状态的影响
Thin Solid Films. 2017 Jan;621:91-97. doi: 10.1016/j.tsf.2016.11.047. Epub 2016 Nov 30.