脉冲电镀频率和占空比对铜膜微观结构及应力状态的影响
The Influence of Pulsed Electroplating Frequency and Duty Cycle on Copper Film Microstructure and Stress State.
作者信息
Marro James B, Darroudi Taghi, Okoro Chukwudi A, Obeng Yaw S, Richardson Kathleen C
机构信息
Glass Processing and Characterization Laboratory/College of Optics and Photonics, CREOL - University of Central Florida, 4304 Scorpius Street, Orlando, FL 32816, USA; School of Material Science & Engineering, Clemson University, COMSET, 161 Sirrine Hall, Clemson, SC 29634, USA.
Electron Microscopy Laboratory, Advanced Materials Research Laboratory (AMRL), Clemson University, 91 Technology Drive, Anderson, SC, 29625, USA.
出版信息
Thin Solid Films. 2017 Jan;621:91-97. doi: 10.1016/j.tsf.2016.11.047. Epub 2016 Nov 30.
In this work we studied the impact of pulse electroplating parameters on the cross-sectional and surface microstructures of blanket copper films using electron backscattering diffraction and x-ray diffraction. The films evaluated were highly (111) textured in the direction perpendicular to the film surface. The degree of preferential orientation was found to decrease with longer pulse on-times, due to strain energy driven growth of other grain orientations. Residual biaxial stresses were also measured in the films and higher pulse frequencies during deposition led to smaller biaxial stresses in the films. Film stress was also found to correlate with the amount of twinning in the copper film cross-sections. This has been attributed to the twins' thermal stability and mechanical properties.
在这项工作中，我们使用电子背散射衍射和X射线衍射研究了脉冲电镀参数对毯式铜膜横截面和表面微观结构的影响。所评估的薄膜在垂直于薄膜表面的方向上具有高度的（111）织构。发现择优取向程度会随着脉冲导通时间的延长而降低，这是由于应变能驱动其他晶粒取向的生长。还测量了薄膜中的残余双轴应力，沉积过程中较高的脉冲频率会导致薄膜中的双轴应力较小。还发现薄膜应力与铜膜横截面中的孪晶数量相关。这归因于孪晶的热稳定性和机械性能。
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