Department of Chemistry and Biochemistry, The Ohio State University, 151 W. Woodruff Avenue, Columbus, Ohio 43210, United States.
Chemical Development, Boehringer Ingelheim Pharmaceuticals, Inc., 900 Ridgebury Road, P.O. Box 368, Ridgefield, Connecticut 06877-0368, United States.
J Am Chem Soc. 2021 Apr 28;143(16):6257-6265. doi: 10.1021/jacs.1c02103. Epub 2021 Apr 16.
Simple copper salts serve as catalysts to effect C-X bond-forming reactions in some of the most utilized transformations in synthesis, including the oxidative coupling of aryl boronic acids and amines. However, these Chan-Lam coupling reactions have historically relied on chemical oxidants that limit their applicability beyond small-scale synthesis. Despite the success of replacing strong chemical oxidants with electrochemistry for a variety of metal-catalyzed processes, electrooxidative reactions with ligandless copper catalysts are plagued by slow electron-transfer kinetics, irreversible copper plating, and competitive substrate oxidation. Herein, we report the implementation of substoichiometric quantities of redox mediators to address limitations to Cu-catalyzed electrosynthesis. Mechanistic studies reveal that mediators serve multiple roles by (i) rapidly oxidizing low-valent Cu intermediates, (ii) stripping Cu metal from the cathode to regenerate the catalyst and reveal the active Pt surface for proton reduction, and (iii) providing anodic overcharge protection to prevent substrate oxidation. This strategy is applied to Chan-Lam coupling of aryl-, heteroaryl-, and alkylamines with arylboronic acids in the absence of chemical oxidants. Couplings under these electrochemical conditions occur with higher yields and shorter reaction times than conventional reactions in air and provide complementary substrate reactivity.
简单的铜盐可作为催化剂,促进一些合成中最常用的转化中的 C-X 键形成反应,包括芳基硼酸和胺的氧化偶联。然而,这些 Chan-Lam 偶联反应历来依赖于化学氧化剂,这限制了它们在小规模合成以外的应用。尽管用电化学代替各种金属催化过程中的强化学氧化剂已经取得了成功,但无配体铜催化剂的电氧化反应受到缓慢的电子转移动力学、不可逆的铜电镀和竞争性底物氧化的困扰。在此,我们报告了亚化学计量的氧化还原介质的实施,以解决 Cu 催化电合成的限制。机理研究表明,介体通过以下几种方式发挥作用:(i)快速氧化低价 Cu 中间体,(ii)从阴极剥离 Cu 金属以再生催化剂并揭示用于质子还原的活性 Pt 表面,以及(iii)提供阳极过充电保护以防止底物氧化。该策略应用于芳基、杂芳基和烷基胺与芳基硼酸的 Chan-Lam 偶联,无需使用化学氧化剂。在这些电化学条件下的偶联反应具有比空气中的传统反应更高的产率和更短的反应时间,并提供互补的底物反应性。