环氧奇亚籽油对聚乳酸的双重增塑剂/热稳定剂作用以改善其延展性和热性能

Dual Plasticizer/Thermal Stabilizer Effect of Epoxidized Chia Seed Oil ( L.) to Improve Ductility and Thermal Properties of Poly(Lactic Acid).

作者信息

Dominguez-Candela Ivan, Ferri Jose Miguel, Cardona Salvador Cayetano, Lora Jaime, Fombuena Vicent

机构信息

Instituto de Seguridad Industrial, Radiofísica y Medioambiental (ISIRYM) Universitat Politècnica de València (UPV), Plaza Ferrándiz y Carbonell s/n, 03801 Alcoy, Spain.

Technological Institute of Materials (ITM), Universitat Politècnica de València (UPV), Plaza Ferrándiz y Carbonell 1, 03801 Alcoy, Spain.

出版信息

Polymers (Basel). 2021 Apr 14;13(8):1283. doi: 10.3390/polym13081283.

The use of a new bio-based plasticizer derived from epoxidized chia seed oil (ECO) was applied in a poly(lactic acid) (PLA) matrix. ECO was used due to its high epoxy content (6.7%), which led to an improved chemical interaction with PLA. Melt extrusion was used to plasticize PLA with different ECO content in the 0-10 wt.% range. Mechanical, morphological, and thermal characterization was carried out to evaluate the effect of ECO percentage. Besides, disintegration and migration tests were studied to assess the future application in packaging industry. Ductile properties improve by 700% in elongation at break with 10 wt.% ECO content. Field emission scanning electron microscopy (FESEM) showed a phase separation with ECO content equal or higher than 7.5 wt.%. Thermal stabilization was improved 14 °C as ECO content increased. All plasticized PLA was disintegrated under composting conditions, not observing a delay up to 5 wt.% ECO. Migration tests pointed out a very low migration, less than 0.11 wt.%, which is to interest to the packaging industry.

一种源自环氧化奇亚籽油（ECO）的新型生物基增塑剂被应用于聚乳酸（PLA）基体中。使用ECO是因为其环氧含量高（6.7%），这使得它与PLA的化学相互作用得到改善。采用熔融挤出法在0 - 10 wt.%范围内用不同含量的ECO对PLA进行增塑。通过机械、形态和热性能表征来评估ECO含量的影响。此外，还研究了崩解和迁移测试，以评估其在包装行业的未来应用。当ECO含量为10 wt.%时，断裂伸长率的韧性性能提高了700%。场发射扫描电子显微镜（FESEM）显示，当ECO含量等于或高于7.5 wt.%时会出现相分离。随着ECO含量的增加，热稳定性提高了14℃。所有增塑的PLA在堆肥条件下都会崩解，在ECO含量达到5 wt.%时未观察到延迟。迁移测试表明迁移率非常低，小于0.11 wt.%，这对包装行业来说很有意义。