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使用掺杂粘合剂凝胶缓冲层实现无缺陷的机械石墨烯转移

Defect-Free Mechanical Graphene Transfer Using Doping Adhesive Gel Buffer.

作者信息

Seo Young-Min, Jang Wonseok, Gu Taejun, Seok Hae-Jun, Han Seunghun, Choi Byoung Lyong, Kim Han-Ki, Chae Heeyeop, Kang Joohoon, Whang Dongmok

机构信息

School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU), 2066 Seobu-ro, Jangan-gu, Suwon-si 16419, Republic of Korea.

School of Chemical Engineering, Sungkyunkwan University (SKKU), 2066 Seobu-ro, Jangan-gu, Suwon-si 16419, Republic of Korea.

出版信息

ACS Nano. 2021 Jul 27;15(7):11276-11284. doi: 10.1021/acsnano.0c10798. Epub 2021 Jun 29.

DOI:10.1021/acsnano.0c10798
PMID:34184867
Abstract

The synthesis of uniform low-defect graphene on a catalytic metal substrate is getting closer to the industrial level. However, its practical application is still challenging due to the lack of an appropriate method for its scalable damage-free transfer to a device substrate. Here, an efficient approach for a defect-free, etchant-free, wrinkle-free, and large-area graphene transfer is demonstrated by exploiting a multifunctional viscoelastic polymer gel as a simultaneous shock-free adhesive and dopant layer. Initially, an amine-rich polymer solution in its liquid form allows for conformal coating on a graphene layer grown on a Cu substrate. The subsequent thermally cured soft gel enables the shock-free and wrinkle-free direct mechanical exfoliation of graphene from a substrate due to its strong charge-transfer interaction with graphene and excellent shock absorption. The adhesive gel with a high optical transparency works as an electron doping layer toward graphene, which exhibits significantly reduced sheet resistances without optical transmittance loss. Lastly, the transferred graphene layer shows high mechanical and chemical stabilities under the repeated bending test and exposure to various solvents. This gel-assisted mechanical transfer method can be a solution to connect the missing part between large-scale graphene synthesis and next-generation electronics and optoelectronic applications.

摘要

在催化金属衬底上合成均匀的低缺陷石墨烯正日益接近工业水平。然而,由于缺乏一种合适的方法将其无损地大规模转移到器件衬底上,其实际应用仍然具有挑战性。在此,通过利用一种多功能粘弹性聚合物凝胶作为同时具备无冲击粘附性和掺杂层的材料,展示了一种用于无缺陷、无蚀刻剂、无褶皱且大面积的石墨烯转移的有效方法。最初,液态的富含胺的聚合物溶液能够在生长于铜衬底上的石墨烯层上实现保形涂层。随后热固化形成的软凝胶由于其与石墨烯之间强大的电荷转移相互作用以及出色的减震性能,能够实现石墨烯从衬底上的无冲击、无褶皱直接机械剥离。具有高光学透明度的粘性凝胶作为石墨烯的电子掺杂层,在不损失光学透过率的情况下,显著降低了薄层电阻。最后,转移后的石墨烯层在反复弯曲测试以及暴露于各种溶剂的情况下,展现出高机械稳定性和化学稳定性。这种凝胶辅助机械转移方法可以解决大规模石墨烯合成与下一代电子和光电子应用之间缺失环节的问题。

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