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通过螺旋-转角-螺旋模体对跨膜双层中的 Holin S105 进行计算模拟及其二聚化。

Computational Simulation of Holin S105 in Membrane Bilayer and Its Dimerization Through a Helix-Turn-Helix Motif.

机构信息

Edgemont Jr.\Sr. High School, 200 White Oak Ln, Scarsdale, NY, 10583, USA.

Department of Systems and Computational Biology, Albert Einstein College of Medicine, 1300 Morris Park Avenue, Bronx, NY, 10461, USA.

出版信息

J Membr Biol. 2021 Aug;254(4):397-407. doi: 10.1007/s00232-021-00187-w. Epub 2021 Jun 29.

Abstract

During the final step of the bacteriophage infection cycle, the cytoplasmic membrane of host cells is disrupted by small membrane proteins called holins. The function of holins in cell lysis is carried out by forming a highly ordered structure called lethal lesion, in which the accumulation of holins in the cytoplasmic membrane leads to the sudden opening of a hole in the middle of this oligomer. Previous studies showed that dimerization of holins is a necessary step to induce their higher order assembly. However, the molecular mechanism underlying the holin-mediated lesion formation is not well understood. In order to elucidate the functions of holin, we first computationally constructed a structural model for our testing system: the holin S105 from bacteriophage lambda. All atom molecular dynamic simulations were further applied to refine its structure and study its dynamics as well as interaction in lipid bilayer. Additional simulations on association between two holins provide supportive evidence to the argument that the C-terminal region of holin plays a critical role in regulating the dimerization. In detail, we found that the adhesion of specific nonpolar residues in transmembrane domain 3 (TMD3) in a polar environment serves as the driven force of dimerization. Our study therefore brings insights to the design of binding interfaces between holins, which can be potentially used to modulate the dynamics of lesion formation.

摘要

在噬菌体感染周期的最后一步中,宿主细胞的细胞质膜被称为孔蛋白的小膜蛋白破坏。孔蛋白在细胞裂解中的功能是通过形成一种称为致死性损伤的高度有序结构来实现的,在这种结构中,孔蛋白在细胞质膜中的积累导致在这个寡聚体的中间突然出现一个孔。先前的研究表明,孔蛋白的二聚化是诱导其高级组装的必要步骤。然而,孔蛋白介导的损伤形成的分子机制尚不清楚。为了阐明孔蛋白的功能,我们首先通过计算构建了我们的测试系统:噬菌体 lambda 的 S105 孔蛋白的结构模型。进一步应用全原子分子动力学模拟来细化其结构,并研究其在脂质双层中的动力学和相互作用。对两个孔蛋白之间的关联的附加模拟为以下论点提供了支持证据,即孔蛋白的 C 末端区域在调节二聚化方面起着关键作用。具体来说,我们发现跨膜域 3(TMD3)中特定非极性残基在极性环境中的粘附充当二聚化的驱动力。因此,我们的研究为孔蛋白之间结合界面的设计提供了新的见解,这可能有助于调节损伤形成的动力学。

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