Zhou Hongyu, Li Yaqiang, Wang Huimin, Ran Minrui, Tong Zhi, Zhang Weidong, Liu Junyou, Zheng Wenyue
National Center for Materials Service Safety, University of Science and Technology Beijing, Beijing 100083, China.
Institute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China.
Materials (Basel). 2021 Jun 10;14(12):3205. doi: 10.3390/ma14123205.
The electronic packaging shell, the necessary material for hermetic packaging of large microelectronic device chips, is made by mechanical processing of a uniform block. However, the property variety requirements at different positions of the shell due to the performance have not been solved. An independently developed liquid-solid separation technology is applied to fabricate the diamond/Al composites with a graded distribution of diamond particles. The diamond content decreases along a gradient from the bottom of the shell, which houses the chips, to the top of the shell wall, which is welded with the cover plate. The bottom of the shell has a thermal conductivity (TC) of 169 W/mK, coefficient of thermal expansion (CTE) of 11.0 × 10/K, bending strength of 88 MPa, and diamond content of 48 vol.%. The top of the shell has a TC of 108 W/mK, CTE of 19.3 × 10/K, bending strength of 175 MPa, and diamond content of 15 vol.%, which solves the special requirements of different parts of the shell and helps to improve the thermal stability of packaging components. Moreover, the interfacial characteristics are also investigated. This work provides a promising approach for the preparation of packaging shells by near-net shape forming.
电子封装外壳是大型微电子器件芯片气密封装的必备材料，由均匀块体经机械加工制成。然而，由于性能原因，外壳不同位置的性能多样化需求尚未得到解决。采用自主研发的液固分离技术制备了金刚石颗粒呈梯度分布的金刚石/铝复合材料。从容纳芯片的外壳底部到与盖板焊接的外壳壁顶部，金刚石含量沿梯度递减。外壳底部的热导率（TC）为169W/mK，热膨胀系数（CTE）为11.0×10⁻⁶/K，抗弯强度为88MPa，金刚石含量为48体积%。外壳顶部的热导率为108W/mK，热膨胀系数为19.3×10⁻⁶/K，抗弯强度为175MPa，金刚石含量为15体积%，解决了外壳不同部位的特殊要求，有助于提高封装组件的热稳定性。此外，还研究了界面特性。这项工作为通过近净成形制备封装外壳提供了一种有前景的方法。
