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金刚石粒度对过滤挤压制备的金刚石/铝基复合材料性能的影响

Influence of diamond particle size on the properties of diamond/Al composites fabricated by filtration extrusion.

作者信息

Zhao Junfeng, Yun Shuohang, Li Qiulin, Wang Liang

机构信息

Guangdong Provincial Key Laboratory of Electronic Functional Materials and Devices, Huizhou University, Huizhou, 516001, China.

Joint Laboratory of Nuclear Materials and Service Safety, Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, China.

出版信息

Heliyon. 2024 Sep 3;10(17):e37391. doi: 10.1016/j.heliyon.2024.e37391. eCollection 2024 Sep 15.

DOI:10.1016/j.heliyon.2024.e37391
PMID:39296005
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC11408779/
Abstract

High-content diamond/Al composites have great potential for application as heat dissipation substrates in high-power electronic devices due to their superior thermal properties. This study addresses the persistent challenge of efficiently and economically preparing high-content diamond/Al composites. The filtration extrusion technique as a novel approach for fabricating these composites and explore the critical impact of diamond particle size on the extrusion process and the resulting microstructures. Our findings reveal that extrusion force remains minimal at the onset of the process but escalates sharply with an increase in diamond content, peaking upon completion of extrusion. Notably, larger diamond particles precipitate a more abrupt rise in extrusion force during displacement. The composites' density and thermal conductivity exhibit an initial increase followed by a decline as the diamond particle size is incremented, while the thermal expansion coefficient shows a progressive rise with size enlargement. These insights are pivotal for optimizing the fabrication parameters to achieve high-performance diamond/Al composites for thermal management applications.

摘要

由于其优异的热性能,高含量金刚石/铝复合材料在高功率电子器件中作为散热基板具有巨大的应用潜力。本研究解决了高效且经济地制备高含量金刚石/铝复合材料这一长期存在的挑战。过滤挤压技术作为一种制造这些复合材料的新方法,探讨了金刚石粒径对挤压过程和所得微观结构的关键影响。我们的研究结果表明,在挤压过程开始时挤压力保持最小,但随着金刚石含量的增加而急剧上升,在挤压完成时达到峰值。值得注意的是,较大的金刚石颗粒在位移过程中会使挤压力更突然地上升。随着金刚石粒径的增加,复合材料的密度和热导率先增加后下降,而热膨胀系数则随粒径增大而逐渐上升。这些见解对于优化制造参数以实现用于热管理应用的高性能金刚石/铝复合材料至关重要。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f170/11408779/0f2cd10c1667/gr10.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f170/11408779/6b31439946d3/gr1.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f170/11408779/817ff34bbf53/gr2.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f170/11408779/1a29b9ec946e/gr3.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f170/11408779/c38ed3b1f762/gr4.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f170/11408779/79aa6a930efa/gr5.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f170/11408779/704a91f5b664/gr6.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f170/11408779/b659f4b25cf5/gr7.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f170/11408779/c943ec606313/gr8.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f170/11408779/61875f0848e7/gr9.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f170/11408779/0f2cd10c1667/gr10.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f170/11408779/6b31439946d3/gr1.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f170/11408779/817ff34bbf53/gr2.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f170/11408779/1a29b9ec946e/gr3.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f170/11408779/c38ed3b1f762/gr4.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f170/11408779/79aa6a930efa/gr5.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f170/11408779/704a91f5b664/gr6.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f170/11408779/b659f4b25cf5/gr7.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f170/11408779/c943ec606313/gr8.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f170/11408779/61875f0848e7/gr9.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f170/11408779/0f2cd10c1667/gr10.jpg

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本文引用的文献

1
Inelastic phonon transport across atomically sharp metal/semiconductor interfaces.非弹性声子在原子级尖锐的金属/半导体界面间的输运。
Nat Commun. 2022 Aug 20;13(1):4901. doi: 10.1038/s41467-022-32600-w.
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Fabrication of Functionally Graded Diamond/Al Composites by Liquid-Solid Separation Technology.采用液固分离技术制备功能梯度金刚石/铝复合材料
Materials (Basel). 2021 Jun 10;14(12):3205. doi: 10.3390/ma14123205.
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Multifunctional Thermal Management Materials with Excellent Heat Dissipation and Generation Capability for Future Electronics.
具有出色散热和发热能力的多功能热管理材料用于未来电子设备
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