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利用大脉冲电子束制备的用于抗热氧化的深度烧结铜轨

Deep-Sintered Copper Tracks for Thermal Oxidation Resistance Using Large Pulsed Electron Beam.

作者信息

Hwang Yunjae, Kim Jisoo, Yim Changyong, Park Hyung Wook

机构信息

School of Mechanical and Nuclear Engineering, Ulsan National Institute of Science and Technology (UNIST), UNIST-gil 50, Eonyang-eup, Ulju-gun, Ulsan 44919, Republic of Korea.

Department of Advanced Science and Technology Convergence, Kyungpook National University (KNU), 2559, Gyeongsang-daero, Sangju-si, Gyeongsangbuk-do 37224, Republic of Korea.

出版信息

ACS Omega. 2021 Jul 13;6(29):19134-19143. doi: 10.1021/acsomega.1c02475. eCollection 2021 Jul 27.

DOI:10.1021/acsomega.1c02475
PMID:34337251
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC8320104/
Abstract

Thermal oxidation resistance is an important property in printed electronics for sustaining electrical conductivity for long time and/or under harsh environments such as high temperature. This study reports the fabrication of copper nanoparticles (CuNPs)-based conductive tracks using large pulsed electron beam (LPEB) by irradiation on CuNPs to be sintered. With an acceleration voltage of 11 kV, the LPEB irradiation induced deep-sintering of CuNPs so that the sintered CuNPs exhibited bulk-like electrical conductivity. Consequently, the sintered Cu tracks maintained high electrical conductivity at 220 °C without using any thermal oxidation protection additive, such as silver, carbon nanotube, and graphene. In contrast, the films irradiated with an acceleration voltage of 8 kV and irradiated by intense pulsed light (IPL) showed fast oxidation characteristics and a corresponding reduction of electrical conductivities under high temperatures owing to a thin sintered layer. The performance of highly thermal oxidation-resistant Cu films sintered by LPEB irradiations was demonstrated through the device performance of a Joule heater.

摘要

在印刷电子领域,抗热氧化性是一项重要性能,有助于在长时间和/或高温等恶劣环境下保持导电性。本研究报告了利用大脉冲电子束(LPEB)对铜纳米颗粒(CuNPs)进行辐照烧结来制备基于CuNPs的导电线路。在11 kV的加速电压下,LPEB辐照促使CuNPs深度烧结,使得烧结后的CuNPs呈现出块状材料的导电性。因此,烧结后的铜线路在220°C下无需使用任何热氧化保护添加剂(如银、碳纳米管和石墨烯)就能保持高导电性。相比之下,用8 kV加速电压辐照并用强脉冲光(IPL)辐照的薄膜由于烧结层较薄,在高温下表现出快速氧化特性以及相应的电导率降低。通过焦耳加热器的器件性能展示了LPEB辐照烧结的高抗热氧化铜薄膜的性能。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0f0f/8320104/38cddc0680ca/ao1c02475_0006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0f0f/8320104/80cd19592ff9/ao1c02475_0002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0f0f/8320104/becd3fef465e/ao1c02475_0003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0f0f/8320104/5d62e04fa34e/ao1c02475_0004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0f0f/8320104/a2779fb90bcd/ao1c02475_0005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0f0f/8320104/38cddc0680ca/ao1c02475_0006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0f0f/8320104/80cd19592ff9/ao1c02475_0002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0f0f/8320104/becd3fef465e/ao1c02475_0003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0f0f/8320104/5d62e04fa34e/ao1c02475_0004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0f0f/8320104/a2779fb90bcd/ao1c02475_0005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0f0f/8320104/38cddc0680ca/ao1c02475_0006.jpg

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