Lewczuk Bogdan, Szyryńska Natalia
Department of Histology and Embryology, Faculty of Veterinary Medicine, University of Warmia and Mazury in Olsztyn, Oczapowskiego 13, 10-719 Olsztyn, Poland.
Animals (Basel). 2021 Nov 27;11(12):3390. doi: 10.3390/ani11123390.
The development of field-emission scanning electron microscopes for high-resolution imaging at very low acceleration voltages and equipped with highly sensitive detectors of backscattered electrons (BSE) has enabled transmission electron microscopy (TEM)-like imaging of the cut surfaces of tissue blocks, which are impermeable to the electron beam, or tissue sections mounted on the solid substrates. This has resulted in the development of methods that simplify and accelerate ultrastructural studies of large areas and volumes of biological samples. This article provides an overview of these methods, including their advantages and disadvantages. The imaging of large sample areas can be performed using two methods based on the detection of transmitted electrons or BSE. Effective imaging using BSE requires special fixation and en bloc contrasting of samples. BSE imaging has resulted in the development of volume imaging techniques, including array tomography (AT) and serial block-face imaging (SBF-SEM). In AT, serial ultrathin sections are collected manually on a solid substrate such as a glass and silicon wafer or automatically on a tape using a special ultramicrotome. The imaging of serial sections is used to obtain three-dimensional (3D) information. SBF-SEM is based on removing the top layer of a resin-embedded sample using an ultramicrotome inside the SEM specimen chamber and then imaging the exposed surface with a BSE detector. The steps of cutting and imaging the resin block are repeated hundreds or thousands of times to obtain a z-stack for 3D analyses.
场发射扫描电子显微镜的发展使得在非常低的加速电压下进行高分辨率成像成为可能,并且配备了高灵敏度的背散射电子(BSE)探测器,这使得对电子束不可穿透的组织块切割表面或安装在固体基板上的组织切片进行类似透射电子显微镜(TEM)的成像成为可能。这导致了一些方法的发展,这些方法简化并加速了对大面积和大量生物样品的超微结构研究。本文概述了这些方法,包括它们的优缺点。对大样本区域的成像可以使用基于透射电子或背散射电子检测的两种方法来进行。使用背散射电子进行有效成像需要对样品进行特殊固定和整体对比。背散射电子成像导致了体积成像技术的发展,包括阵列断层扫描(AT)和连续块面成像(SBF-SEM)。在阵列断层扫描中,连续超薄切片手动收集在诸如玻璃和硅片等固体基板上,或者使用特殊的超薄切片机自动收集在磁带上。对连续切片进行成像以获得三维(3D)信息。连续块面成像扫描电子显微镜基于在扫描电子显微镜样品室内使用超薄切片机去除树脂包埋样品的顶层,然后用背散射电子探测器对暴露的表面进行成像。对树脂块进行切割和成像的步骤重复数百次或数千次,以获得用于三维分析的z轴堆叠图像。