Seo Beomdeok, Kanematsu Hideyuki, Nakamoto Masashi, Miyabayashi Yoshitsugu, Tanaka Toshihiro
Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita 565-0871, Osaka, Japan.
Department of Materials Science and Engineering, National Institute of Technology (KOSEN), Suzuka College, Suzuka 510-0294, Mie, Japan.
Materials (Basel). 2022 Jan 5;15(1):392. doi: 10.3390/ma15010392.
In this work, a copper coating is developed on a carbon steel substrate by exploiting the superwetting properties of liquid copper. We characterize the surface morphology, chemical composition, roughness, wettability, ability to release a copper ion from surfaces, and antibacterial efficacy (against and ). The coating shows a dense microstructure and good adhesion, with thicknesses of approximately 20-40 µm. X-ray diffraction (XRD) analysis reveals that the coated surface structure is composed of Cu, CuO, and CuO. The surface roughness and contact angle measurements suggest that the copper coating is rougher and more hydrophobic than the substrate. Inductively coupled plasma atomic emission spectroscopy (ICP-AES) measurements reveal a dissolution of copper ions in chloride-containing environments. The antibacterial test shows that the copper coating achieves a 99.99% reduction of and . This study suggests that the characteristics of the copper-coated surface, including the chemical composition, high surface roughness, good wettability, and ability for copper ion release, may result in surfaces with antibacterial properties.
在这项工作中，通过利用液态铜的超润湿性，在碳钢基底上制备了一层铜涂层。我们对其表面形貌、化学成分、粗糙度、润湿性、从表面释放铜离子的能力以及抗菌效果（针对 和 ）进行了表征。该涂层呈现出致密的微观结构和良好的附着力，厚度约为20 - 40微米。X射线衍射（XRD）分析表明，涂层表面结构由Cu、CuO和CuO组成。表面粗糙度和接触角测量结果表明，铜涂层比基底更粗糙且更疏水。电感耦合等离子体原子发射光谱（ICP - AES）测量显示，在含氯环境中铜离子会溶解。抗菌测试表明，铜涂层可使 和 减少99.99%。这项研究表明，铜涂层表面的特性，包括化学成分、高表面粗糙度、良好的润湿性以及铜离子释放能力，可能导致表面具有抗菌性能。
