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Cu 点氧化涂层表面的超亲水性和抗菌性能。

Superhydrophilicity and antibacterial property of a Cu-dotted oxide coating surface.

机构信息

Tecnie Corporation, Windsor, Ontario, Canada.

出版信息

Ann Clin Microbiol Antimicrob. 2010 Sep 16;9:25. doi: 10.1186/1476-0711-9-25.

Abstract

BACKGROUND

Aluminum-made settings are widely used in healthcare, schools, public facilities and transit systems. Frequently-touched surfaces of those settings are likely to harbour bacteria and be a potential source of infection. One method to utilize the effectiveness of copper (Cu) in eliminating pathogens for these surfaces would be to coat the aluminum (Al) items with a Cu coating. However, such a combination of Cu and Al metals is susceptible to galvanic corrosion because of their different electrochemical potentials.

METHODS

In this work, a new approach was proposed in which electrolytic plasma oxidation (EPO) of Al was used to form an oxide surface layer followed by electroplating of Cu metal on the top of the oxide layer. The oxide was designed to function as a corrosion protective and biocompatible layer, and the Cu in the form of dots was utilized as an antibacterial material. The antibacterial property enhanced by superhydrophilicity of the Cu-dotted oxide coating was evaluated.

RESULTS

A superhydrophilic surface was successfully prepared using electrolytic plasma oxidation of aluminum (Al) followed by electroplating of copper (Cu) in a Cu-dotted form. Both Cu plate and Cu-dotted oxide surfaces had excellent antimicrobial activities against E. coli ATCC 25922, methicillin-resistant Staphylococcus aureus (MRSA) ATCC 43300 and vancomycin-resistant Enterococcus faecium (VRE) ATCC 51299. However, its Cu-dotted surface morphology allowed the Cu-dotted oxide surface to be more antibacterial than the smooth Cu plate surface. The enhanced antibacterial property was attributed to the superhydrophilic behaviour of the Cu-dotted oxide surface that allowed the bacteria to have a more effective killing contact with Cu due to spreading of the bacterial suspension media.

CONCLUSION

The superhydrophilic Cu-dotted oxide coating surface provided an effective method of controlling bacterial growth and survival on contact surfaces and thus reduces the risk of infection and spread of bacteria-related diseases particularly in moist or wet environments.

摘要

背景

铝制制品在医疗保健、学校、公共设施和交通系统中被广泛应用。这些制品的高频接触表面可能藏匿细菌,并成为潜在的感染源。一种利用铜(Cu)消除这些表面病原体的有效性的方法是在铝(Al)制品上涂覆一层 Cu 涂层。然而,由于 Cu 和 Al 金属的电化学电位不同,这种 Cu 和 Al 金属的组合容易发生电偶腐蚀。

方法

在这项工作中,提出了一种新的方法,即通过铝的电解等离子体氧化(EPO)形成氧化物表面层,然后在氧化物层的顶部电镀 Cu 金属。氧化物层的设计具有防腐和生物相容性,而以点状形式存在的 Cu 则被用作抗菌材料。评估了具有超亲水性的点状氧化物涂层增强的抗菌性能。

结果

成功地使用铝的电解等离子体氧化(Al)和点状形式的 Cu 电镀在 Al 上制备了超亲水表面。Cu 板和点状氧化物表面都对大肠杆菌 ATCC 25922、耐甲氧西林金黄色葡萄球菌(MRSA)ATCC 43300 和万古霉素耐药肠球菌(VRE)ATCC 51299 具有出色的抗菌活性。然而,其点状表面形貌使点状氧化物表面比光滑的 Cu 板表面更具抗菌性。增强的抗菌性能归因于点状氧化物表面的超亲水性行为,由于细菌悬浮介质的扩散,使细菌能够更有效地与 Cu 进行杀伤接触。

结论

超亲水的 Cu 点状氧化物涂层表面提供了一种控制接触表面细菌生长和存活的有效方法,从而降低了细菌相关疾病在潮湿或湿润环境中感染和传播的风险。

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