Lee Jeong-Heon, Kwak Jae B
School of Mechanical System and Automotive Engineering, Chosun University, 309 Pilmun-daero, Gwangju 61452, Korea.
Department of Mechanical Engineering, Chosun University, 309 Pilmun-daero, Gwangju 61452, Korea.
Materials (Basel). 2022 Jan 26;15(3):948. doi: 10.3390/ma15030948.
The mechanical properties of thin films are under-researched because of the challenges associated with conventional experimental methods. We demonstrate a technique for determining the intrinsic shear strength and strain of thin films using a nano-cutting technique based on an orthogonal cutting model with precise control of the cutting system. In this study, electroplated Cu films with thicknesses of 1.5 μm and 5 μm and a sputtered Cu film with a thickness of 130 nm were fabricated to evaluate the mechanical strength. Experiments revealed a shear strength of approximately 310 MPa with a shear strain of 1.57 for the electroplated Cu film and a shear strength of 389 MPa with a shear strain of 2.03 for the sputtered Cu film. In addition, X-ray diffraction analysis was performed to correlate the experimental results.
由于传统实验方法存在挑战，薄膜的力学性能研究不足。我们展示了一种使用基于正交切削模型的纳米切削技术来确定薄膜固有剪切强度和应变的技术，该技术对切削系统有精确控制。在本研究中，制备了厚度为1.5μm和5μm的电镀铜薄膜以及厚度为130nm的溅射铜薄膜，以评估其机械强度。实验表明，电镀铜薄膜的剪切强度约为310MPa，剪切应变为1.57；溅射铜薄膜的剪切强度为389MPa，剪切应变为2.03。此外，还进行了X射线衍射分析以关联实验结果。
