Liu Peisheng, She Chenhui, Tan Lipeng, Xu Pengpeng, Yan Lei
Jiangsu Key Laboratory of ASIC Design, School of Information Science and Technology, Nantong University, Nantong 226019, China.
Micromachines (Basel). 2022 Jan 30;13(2):229. doi: 10.3390/mi13020229.
LEDs are widely used in medicine, navigation and landscape lighting. The development of high-power LED is a severe challenge to LED heat dissipation. In this review, packaging technology and packaging structure are reviewed in terms of the thermal performance of LED packaging, and related technologies that promote heat dissipation in LED packaging are introduced. The design of three components to enhance heat dissipation in LED packaging is described: substrate, lens and phosphor layer. By conducting a summary of the technology and structure of the package, the defects of LED package technology and structure are deeply investigated, and the package is prospected. This has reference value for the heat dissipation design of the LED package and helps to improve the design and manufacture of the LED package.
发光二极管广泛应用于医学、导航和景观照明领域。高功率发光二极管的发展对其散热提出了严峻挑战。本文综述了发光二极管封装的热性能方面的封装技术和封装结构，并介绍了促进发光二极管封装散热的相关技术。阐述了用于增强发光二极管封装散热的三个组件的设计：基板、透镜和荧光粉层。通过对封装技术和结构进行总结，深入研究了发光二极管封装技术和结构的缺陷，并对封装进行了展望。这对发光二极管封装的散热设计具有参考价值，有助于改进发光二极管封装的设计与制造。
