Gojdka Björn, Cichon Daniel, Lembrecht Yannik, Bodduluri Mani Teja, Lisec Thomas, Stahl-Offergeld Markus, Hohe Hans-Peter, Niekiel Florian
Fraunhofer Institute for Silicon Technology ISIT, Fraunhoferstr. 1, 25524 Itzehoe, Germany.
Fraunhofer Institute for Integrated Circuits IIS, Am Wolfsmantel 33, 91058 Erlangen, Germany.
Micromachines (Basel). 2022 Jan 30;13(2):235. doi: 10.3390/mi13020235.
A fully integrable magnetic microposition detection for miniaturized systems like MEMS devices is demonstrated. Whereas current magnetic solutions are based on the use of hybrid mounted magnets, here a combination of Hall sensors with a novel kind of wafer-level integrable micromagnet is presented. 1D measurements achieve a precision <10 µm within a distance of 1000 µm. Three-dimensional (3D) measurements demonstrate the resolution of complex trajectories in a millimeter-sized space with precision better than 50 µm in real time. The demonstrated combination of a CMOS Hall sensor and wafer-level embedded micromagnets enables a fully integrable magnetic position detection for microdevices such as scanners, switches, valves and flow regulators, endoscopes or tactile sensors.
展示了一种适用于MEMS器件等小型化系统的完全可集成磁微位置检测方法。当前的磁解决方案基于混合安装磁体的使用,而本文提出了一种霍尔传感器与新型晶圆级可集成微磁体的组合。一维测量在1000 µm的距离内实现了精度<10 µm。三维(3D)测量表明,能够在毫米级空间中实时解析复杂轨迹,精度优于50 µm。所展示的CMOS霍尔传感器与晶圆级嵌入式微磁体的组合,为诸如扫描仪、开关、阀门和流量调节器、内窥镜或触觉传感器等微型设备实现了完全可集成的磁位置检测。