Lisec Thomas, Behrmann Ole, Gojdka Björn
Fraunhofer Institute for Silicon Technology ISIT, Fraunhoferstr. 1, 25524 Itzehoe, Germany.
Micromachines (Basel). 2022 Feb 28;13(3):398. doi: 10.3390/mi13030398.
A comprehensive overview of PowderMEMS-a novel back-end-of-line-compatible microfabrication technology-is presented in this paper. The PowderMEMS process solidifies micron-sized particles via atomic layer deposition (ALD) to create three-dimensional microstructures on planar substrates from a wide variety of materials. The process offers numerous degrees of freedom for the design of functional MEMSs, such as a wide choice of different material properties and the precise definition of 3D volumes at the substrate level, with a defined degree of porosity. This work details the characteristics of PowderMEMS materials as well as the maturity of the fabrication technology, while highlighting prospects for future microdevices. Applications of PowderMEMS in the fields of magnetic, thermal, optical, fluidic, and electrochemical MEMSs are described, and future developments and challenges of the technology are discussed.
本文全面概述了粉末微机电系统(PowderMEMS)——一种新型的与后端兼容的微细加工技术。粉末微机电系统工艺通过原子层沉积(ALD)使微米级颗粒固化,从而在平面基板上由多种材料创建三维微结构。该工艺为功能性微机电系统的设计提供了众多自由度,例如可广泛选择不同的材料特性,并在基板层面精确界定具有特定孔隙率的三维体积。本文详细阐述了粉末微机电系统材料的特性以及制造技术的成熟度,同时突出了未来微型器件的前景。描述了粉末微机电系统在磁性、热学、光学、流体和电化学微机电系统领域的应用,并讨论了该技术未来的发展和挑战。