Dai Huanyu, Wang Ridong
State Key Laboratory of Precision Measuring Technology and Instruments, Tianjin University, Tianjin 300072, China.
Nanomaterials (Basel). 2022 Feb 9;12(4):589. doi: 10.3390/nano12040589.
Two-dimensional (2D) materials are widely used in microelectronic devices due to their excellent optical, electrical, and mechanical properties. The performance and reliability of microelectronic devices based 2D materials are affected by heat dissipation performance, which can be evaluated by studying the thermal conductivity of 2D materials. Currently, many theoretical and experimental methods have been developed to characterize the thermal conductivity of 2D materials. In this paper, firstly, typical theoretical methods, such as molecular dynamics, phonon Boltzmann transport equation, and atomic Green's function method, are introduced and compared. Then, experimental methods, such as suspended micro-bridge, 3ω, time-domain thermal reflectance and Raman methods, are systematically and critically reviewed. In addition, the physical factors affecting the thermal conductivity of 2D materials are discussed. At last, future prospects for both theoretical and experimental thermal conductivity characterization of 2D materials is given. This paper provides an in-depth understanding of the existing thermal conductivity measurement methods of 2D materials, which has guiding significance for the application of 2D materials in micro/nanodevices.
二维(2D)材料因其优异的光学、电学和机械性能而被广泛应用于微电子器件中。基于二维材料的微电子器件的性能和可靠性受散热性能影响,而散热性能可通过研究二维材料的热导率来评估。目前,已经开发了许多理论和实验方法来表征二维材料的热导率。本文首先介绍并比较了典型的理论方法,如分子动力学、声子玻尔兹曼输运方程和原子格林函数方法。然后,对悬浮微桥、3ω、时域热反射和拉曼等实验方法进行了系统而批判性的综述。此外,还讨论了影响二维材料热导率的物理因素。最后,给出了二维材料热导率表征在理论和实验方面的未来前景。本文深入介绍了现有的二维材料热导率测量方法,对二维材料在微纳器件中的应用具有指导意义。