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一款基于大规模微机电系统的硅光子学激光雷达。

A large-scale microelectromechanical-systems-based silicon photonics LiDAR.

机构信息

Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, Berkeley, CA, USA.

出版信息

Nature. 2022 Mar;603(7900):253-258. doi: 10.1038/s41586-022-04415-8. Epub 2022 Mar 9.

DOI:10.1038/s41586-022-04415-8
PMID:35264759
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC8907073/
Abstract

Three-dimensional (3D) imaging sensors allow machines to perceive, map and interact with the surrounding world. The size of light detection and ranging (LiDAR) devices is often limited by mechanical scanners. Focal plane array-based 3D sensors are promising candidates for solid-state LiDARs because they allow electronic scanning without mechanical moving parts. However, their resolutions have been limited to 512 pixels or smaller. In this paper, we report on a 16,384-pixel LiDAR with a wide field of view (FoV, 70° × 70°), a fine addressing resolution (0.6° × 0.6°), a narrow beam divergence (0.050° × 0.049°) and a random-access beam addressing with sub-MHz operation speed. The 128 × 128-element focal plane switch array (FPSA) of grating antennas and microelectromechanical systems (MEMS)-actuated optical switches are monolithically integrated on a 10 × 11-mm silicon photonic chip, where a 128 × 96 subarray is wire bonded and tested in experiments. 3D imaging with a distance resolution of 1.7 cm is achieved with frequency-modulated continuous-wave (FMCW) ranging in monostatic configuration. The FPSA can be mass-produced in complementary metal-oxide-semiconductor (CMOS) foundries, which will allow ubiquitous 3D sensors for use in autonomous cars, drones, robots and smartphones.

摘要

三维（3D）成像传感器使机器能够感知、绘制和与周围环境交互。激光雷达（LiDAR）设备的尺寸通常受到机械扫描仪的限制。基于面阵的 3D 传感器是固态 LiDAR 的有前途的候选者，因为它们允许电子扫描而无需机械运动部件。然而，它们的分辨率一直受到限制，最高可达 512 像素或更小。在本文中，我们报告了一种具有宽视场（FoV，70°×70°）、精细寻址分辨率（0.6°×0.6°）、窄光束发散角（0.050°×0.049°）和随机访问光束寻址功能的 16384 像素 LiDAR，其工作速度可达亚兆赫兹。光栅天线和微机电系统（MEMS）驱动的光学开关的 128×128 元焦平面开关阵列（FPSA）被单片集成在一个 10×11mm 的硅光子芯片上，其中一个 128×96 子阵通过金丝键合进行测试。在单基地配置中，通过调频连续波（FMCW）测距实现了 1.7cm 的距离分辨率的 3D 成像。FPSA 可以在互补金属氧化物半导体（CMOS）工厂中大规模生产，这将为自动驾驶汽车、无人机、机器人和智能手机提供无处不在的 3D 传感器。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fdff/8907073/f13287fb0de4/41586_2022_4415_Fig11_ESM.jpg
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https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fdff/8907073/4b76f08c8db6/41586_2022_4415_Fig1_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fdff/8907073/df642782a284/41586_2022_4415_Fig2_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fdff/8907073/26d2e6dfee4e/41586_2022_4415_Fig3_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fdff/8907073/8ac9f323f14f/41586_2022_4415_Fig4_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fdff/8907073/384386ef2977/41586_2022_4415_Fig5_ESM.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fdff/8907073/82859ef3e124/41586_2022_4415_Fig6_ESM.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fdff/8907073/3b5d503f30b7/41586_2022_4415_Fig7_ESM.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fdff/8907073/d8ac6328c251/41586_2022_4415_Fig8_ESM.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fdff/8907073/e57728bd40e0/41586_2022_4415_Fig9_ESM.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fdff/8907073/2bc8f40c25b3/41586_2022_4415_Fig10_ESM.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fdff/8907073/f13287fb0de4/41586_2022_4415_Fig11_ESM.jpg

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