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多芯片扇出型晶圆级封装工艺的翘曲研究

Investigation of Warpage for Multi-Die Fan-Out Wafer-Level Packaging Process.

作者信息

Chen Chuan, Su Meiying, Ma Rui, Zhou Yunyan, Li Jun, Cao Liqiang

机构信息

Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China.

出版信息

Materials (Basel). 2022 Feb 23;15(5):1683. doi: 10.3390/ma15051683.

DOI:10.3390/ma15051683
PMID:35268913
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC8911451/
Abstract

This paper focuses on characterizing the evolution of warpage, effects of epoxy molding compound (EMC), and effects of carrier 2 (the second carrier in the process) of 12 inch RDL-first multi-die fan-out wafer-level packaging (FOWLP) during the manufacturing process. The linear viscoelasticity properties of EMC and polyimide (PI) were characterized using dynamic mechanical analysis (DMA) in the frequency domain at different temperatures., The elastic and viscoelastic model were used for PI and EMC, the finite element analyses (FEA) of the cured structure were carried out and the results were compared with the test results. The viscoelastic properties of the EMC in the FEA could predict the wafer warpage more accurately. The FEA and experiments were used to investigate the evolution of warpage. The molding had a great influence on the warpage. The effects of the EMC and carrier 2 were also investigated with FEA. The wafer warpage could be reduced by lowering the thickness of the EMC, increasing the thickness of carrier 2, and selecting EMC and carrier 2 with a matched coefficient of thermal expansion (CTE).

摘要

本文重点研究12英寸先RDL多芯片扇出型晶圆级封装（FOWLP）制造过程中翘曲的演变、环氧模塑料（EMC）的影响以及载体2（该工艺中的第二个载体）的影响。通过动态力学分析（DMA）在不同温度的频域中对EMC和聚酰亚胺（PI）的线性粘弹性特性进行了表征。采用弹性和粘弹性模型对PI和EMC进行分析，对固化结构进行了有限元分析（FEA），并将结果与测试结果进行了比较。有限元分析中EMC的粘弹性特性能够更准确地预测晶圆翘曲。利用有限元分析和实验研究了翘曲的演变。模塑对翘曲有很大影响。还通过有限元分析研究了EMC和载体2的影响。通过降低EMC的厚度、增加载体2的厚度以及选择具有匹配热膨胀系数（CTE）的EMC和载体2，可以减少晶圆翘曲。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5792/8911451/d0481dfba528/materials-15-01683-g013.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5792/8911451/67c3cce05f78/materials-15-01683-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5792/8911451/08a6b062809f/materials-15-01683-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5792/8911451/148cfb0a0ec7/materials-15-01683-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5792/8911451/803a423c1a30/materials-15-01683-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5792/8911451/a5e70cd6fa51/materials-15-01683-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5792/8911451/d820ee0c6075/materials-15-01683-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5792/8911451/6332a7f61f1e/materials-15-01683-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5792/8911451/eaf916e6c660/materials-15-01683-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5792/8911451/7df4d8f66730/materials-15-01683-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5792/8911451/293bd6c9745a/materials-15-01683-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5792/8911451/f4e9e851fd8a/materials-15-01683-g011.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5792/8911451/fb74005a85f1/materials-15-01683-g012.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5792/8911451/d0481dfba528/materials-15-01683-g013.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5792/8911451/67c3cce05f78/materials-15-01683-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5792/8911451/08a6b062809f/materials-15-01683-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5792/8911451/148cfb0a0ec7/materials-15-01683-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5792/8911451/803a423c1a30/materials-15-01683-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5792/8911451/a5e70cd6fa51/materials-15-01683-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5792/8911451/d820ee0c6075/materials-15-01683-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5792/8911451/6332a7f61f1e/materials-15-01683-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5792/8911451/eaf916e6c660/materials-15-01683-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5792/8911451/7df4d8f66730/materials-15-01683-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5792/8911451/293bd6c9745a/materials-15-01683-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5792/8911451/f4e9e851fd8a/materials-15-01683-g011.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5792/8911451/fb74005a85f1/materials-15-01683-g012.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5792/8911451/d0481dfba528/materials-15-01683-g013.jpg

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