Lebioda Marcin, Korzeniewska Ewa
Institute of Electrical Engineering Systems, Lodz University of Technology, Stefanowskiego 18, 90-537 Lodz, Poland.
Materials (Basel). 2022 Feb 28;15(5):1814. doi: 10.3390/ma15051814.
Thin layers are widely used in electronics and protective coatings. They are also increasingly used in wearable electronics. A major challenge affecting the use of thin layers is their connection to flexible substrates, particularly textile products. This article describes the stability of the resistance of a silver layer with a thickness of 250 nm in a wide temperature range of 15-295 K. The aim was to determine the temperature dependence of the resistance of layers formed on a composite textile substrate compared with that of layers produced on an AlO substrate. The results showed that the electrical parameters of the layer formed on the composite textile substrate changed in a manner atypical for metallic layers. This may have been due to the polyurethane base layer. The roughness and ability to deform under the influence of heat of the substrate can significantly affect the electrical parameters of a thin metal layer produced by the PVD coating process, which is important for the design of textronic applications.
薄层在电子学和防护涂层中有着广泛应用。它们在可穿戴电子设备中的使用也日益增加。影响薄层使用的一个主要挑战是它们与柔性基板,特别是纺织产品的连接。本文描述了厚度为250 nm的银层在15 - 295 K的宽温度范围内的电阻稳定性。目的是确定在复合纺织基板上形成的层的电阻与在AlO基板上产生的层的电阻的温度依赖性。结果表明,在复合纺织基板上形成的层的电学参数变化方式对于金属层来说是非典型的。这可能是由于聚氨酯基层。基板的粗糙度和在热影响下的变形能力会显著影响通过物理气相沉积(PVD)涂层工艺生产的薄金属层的电学参数,这对于纺织电子应用的设计很重要。