Lebioda Marcin, Korzeniewska Ewa
Institute of Electrical Engineering Systems, Lodz University of Technology, Stefanowskiego 18, 90-537 Lodz, Poland.
Materials (Basel). 2023 Jul 6;16(13):4856. doi: 10.3390/ma16134856.
In the era of developing wearable electronics, the miniaturization of electronic systems and their implementation in the textile industry is one of the key issues. For this reason, it is important to select the appropriate textile substrates upon which it is possible to produce electroconductive structures, as well as their selection from the point of view of the electrical parameters' stability. For this purpose, research related to the effect of heating a substrate on the resistance of the structures produced in the process of physical vacuum planting was conducted. Textile composites with a buffer layer made of polyurethane, Teflon, and acrylic were used as substrates in the tests. Such layers are an integral part of textile composites and a necessary element for producing structures with continuous electrical conductivity. The conducted tests showed that a buffer layer made of polyurethane (thermal conductivity, e.g., PERMACOL 5450 resin 0.16 W/mK) heated to 15 °C above room temperature was a layer that introduced changes into the surface resistance of the structures. The resistance values of the samples produced on a substrate containing a buffer layer of polyurethane varied in the range of 9-23%, depending on the manufacturer of the composite in the case of a self-heating mode, and in the case of an external heating mode, these changes were smaller and ranged from 8 to 16%. Such a phenomenon occurred regardless of the type of applied metal, and this was not observed in the case of composites with a Teflon or acrylic sublayer. For this reason, it is necessary to take into account the fact that textronic structures made on substrates containing a polyurethane layer may change the surface resistance depending on the temperature. The electrical parameters of such structures were checked by heating the structure using an external heater and self-heating mechanism. The same phenomenon was observed in both cases.
在可穿戴电子设备发展的时代,电子系统的小型化及其在纺织工业中的应用是关键问题之一。因此,选择合适的纺织基材以生产导电结构,并从电参数稳定性的角度进行选择非常重要。为此,开展了与加热基材对物理真空镀膜过程中所生产结构电阻的影响相关的研究。测试中使用了由聚氨酯、特氟龙和丙烯酸制成的带有缓冲层的纺织复合材料作为基材。这些层是纺织复合材料的组成部分,也是生产具有连续导电性结构的必要元素。所进行的测试表明,加热至比室温高15°C的由聚氨酯制成的缓冲层(例如PERMACOL 5450树脂的热导率为0.16 W/mK)是会使结构表面电阻发生变化的一层。在自热模式下,在含有聚氨酯缓冲层的基材上生产的样品的电阻值变化范围为9 - 23%,具体取决于复合材料的制造商;在外部加热模式下,这些变化较小,范围为8 - 16%。无论所应用的金属类型如何,都会出现这种现象,而在带有特氟龙或丙烯酸子层的复合材料中则未观察到这种现象。因此,有必要考虑到在含有聚氨酯层的基材上制成的纺织电子结构可能会根据温度改变表面电阻这一事实。通过使用外部加热器和自热机制加热结构来检查此类结构的电参数。在两种情况下都观察到了相同的现象。