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用于柔性微机电系统应用的功能性聚酰亚胺薄膜及微结构的微纳制造。

Microfabrication of functional polyimide films and microstructures for flexible MEMS applications.

作者信息

Dong Zihao, He Qipei, Shen Dawei, Gong Zheng, Zhang Deyuan, Zhang Wenqiang, Ono Takahito, Jiang Yonggang

机构信息

Institute of Bionic and Micronano Systems, School of Mechanical Engineering and Automation, Beihang University, Beijing, 100191 China.

College of Engineering, China Agricultural University, Beijing, 100083 China.

出版信息

Microsyst Nanoeng. 2023 Mar 21;9:31. doi: 10.1038/s41378-023-00503-5. eCollection 2023.

Abstract

Polyimides are widely used in the MEMS and flexible electronics fields due to their combined physicochemical properties, including high thermal stability, mechanical strength, and chemical resistance values. In the past decade, rapid progress has been made in the microfabrication of polyimides. However, enabling technologies, such as laser-induced graphene on polyimide, photosensitive polyimide micropatterning, and 3D polyimide microstructure assembly, have not been reviewed from the perspective of polyimide microfabrication. The aims of this review are to systematically discuss polyimide microfabrication techniques, which cover film formation, material conversion, micropatterning, 3D microfabrication, and their applications. With an emphasis on polyimide-based flexible MEMS devices, we discuss the remaining technological challenges in polyimide fabrication and possible technological innovations in this field.

摘要

聚酰亚胺因其综合的物理化学性质,包括高热稳定性、机械强度和耐化学性,而被广泛应用于微机电系统(MEMS)和柔性电子领域。在过去十年中,聚酰亚胺的微加工取得了快速进展。然而,诸如聚酰亚胺上的激光诱导石墨烯、光敏聚酰亚胺微图案化和3D聚酰亚胺微结构组装等使能技术尚未从聚酰亚胺微加工的角度进行综述。本综述的目的是系统地讨论聚酰亚胺微加工技术,包括成膜、材料转化、微图案化、3D微加工及其应用。重点关注基于聚酰亚胺的柔性MEMS器件,我们讨论了聚酰亚胺制造中剩余的技术挑战以及该领域可能的技术创新。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/e090/10030833/d493163addee/41378_2023_503_Fig1_HTML.jpg

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