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具有复杂电子结构和化学键软化的Sb-Br共掺杂BiSe中热电性能的增强

Enhanced thermoelectric performance in Sb-Br codoped BiSe with complex electronic structure and chemical bond softening.

作者信息

Zhang Ju, Zhong Shiqi, Ke San-Huang

机构信息

MOE Key Laboratory of Microstructured Materials, School of Physics Science and Engineering, Tongji University 1239 Siping Road Shanghai 200092 China

出版信息

RSC Adv. 2022 Jan 11;12(3):1653-1662. doi: 10.1039/d1ra08726f. eCollection 2022 Jan 5.

DOI:10.1039/d1ra08726f
PMID:35425166
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC8978978/
Abstract

Prior experimental work showed that BiSe, as a sister compound of the best room-temperature thermoelectric material BiTe, has remarkably improved thermoelectric performance by Sb-Br codoping. But the relationship between its crystalline structure and thermoelectric properties is still unclear to date. Here, we use first-principles calculations to explore the possible reasons for such improvement. The electronic structures of Bi Sb (Se Br ) ( = 0, 1, 2; = 0, 0.08) are systematically investigated. Significant effects of 8% Br codoping in BiSbSe are found. First, the Br atom acts as an electron donor, thus greatly increasing the carrier concentration. Second, similar to the effect of Sb doping, Br codoping further improves greatly the degeneracy of the conduction band edge, which leads to a remarkably increased density-of-states effective mass without deterioration of the carrier mobility, and simultaneously preserves a large Seebeck coefficient of ∼-254 μV K at 800 K. In addition, the Br codoping softens the chemical bonds, which enhances anharmonic scattering and further reduces the lattice thermal conductivity. We predict that the maximum of BiSb(SeBr) at 800 K can reach 0.96 with the carrier concentration of 9.22 × 10 cm. This study rationalizes a potential strategy to improve the thermoelectric performance of BiSe-based thermoelectric materials.

摘要

先前的实验工作表明,作为最佳室温热电材料BiTe的姊妹化合物,BiSe通过Sb-Br共掺杂显著提高了热电性能。但迄今为止,其晶体结构与热电性能之间的关系仍不清楚。在此,我们使用第一性原理计算来探究这种性能提升的可能原因。系统研究了BiSb(SeBr)₂(x = 0, 1, 2;y = 0, 0.08)的电子结构。发现8%的Br共掺杂对BiSbSe有显著影响。首先,Br原子作为电子供体,从而大大提高了载流子浓度。其次,与Sb掺杂的效果类似,Br共掺杂进一步极大地改善了导带边缘的简并度,这导致态密度有效质量显著增加,而载流子迁移率没有恶化,同时在800 K时保持了约-254 μV K的大塞贝克系数。此外,Br共掺杂使化学键变软,增强了非谐散射并进一步降低了晶格热导率。我们预测,在载流子浓度为9.22×10²¹ cm⁻³时,BiSb(SeBr)₂在800 K时的最大热电优值可达到0.96。本研究阐明了一种提高BiSe基热电材料热电性能的潜在策略。

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