Chang Yih-Ren, Nishimura Tomonori, Taniguchi Takashi, Watanabe Kenji, Nagashio Kosuke
Department of Materials Engineering, The University of Tokyo, 7-3-1 Hongo, Bunkyo, Tokyo 113-8656, Japan.
International Center for Materials Nanoarchitectonics, National Institute of Materials Science, 1-1 Namiki, Tsukuba, Ibaraki 305-0044, Japan.
ACS Appl Mater Interfaces. 2022 May 4;14(17):19928-19937. doi: 10.1021/acsami.2c05534. Epub 2022 Apr 20.
Searching for the counterpart of well-developed two-dimensional (2D) n-type field effect transistors (FETs) is indispensable for complementary logic circuit applications for 2D devices. Although SnS is regarded as a potential candidate for high-performance p-type FETs, recent experiments only show poor results deviating from the theoretically predicted high mobility. In this research, the serious performance degradation due to the surface oxidation of SnS, which commonly occurs in most 2D materials, is addressed through surface oxide conversion using highly reactive Ti. In this conversion process, which is confirmed by systematic characterization, the reduction of SnS surface oxide is accompanied by the formation of functional titanium oxide, which works as both a conductive intermediate layer to improve the contact property and a buffer layer of the high- top gate insulator at the channel region. Consequently, a record-high field effect mobility of 87.4 cm V s in SnS p-type FETs is achieved. The surface oxide conversion method applied here is consistent with our previous thermodynamic prediction, and this novel technique can be widely introduced to all 2D materials that are vulnerable to oxidation and facilitate the future development of 2D devices.
寻找成熟的二维(2D)n型场效应晶体管(FET)的对应物对于二维器件的互补逻辑电路应用至关重要。尽管SnS被认为是高性能p型FET的潜在候选材料,但最近的实验结果却不尽人意,与理论预测的高迁移率相差甚远。在本研究中,针对大多数二维材料中普遍存在的SnS表面氧化导致的严重性能退化问题,通过使用高活性Ti进行表面氧化物转化来解决。在这一转化过程中,经系统表征证实,SnS表面氧化物的还原伴随着功能性钛氧化物的形成,该钛氧化物既作为导电中间层改善接触性能,又作为沟道区域高顶栅绝缘体的缓冲层。因此,SnS p型FET实现了创纪录的87.4 cm² V⁻¹ s⁻¹的场效应迁移率。这里应用的表面氧化物转化方法与我们之前的热力学预测一致,这种新技术可广泛应用于所有易氧化的二维材料,推动二维器件的未来发展。