发霉印刷电路板在10毫特斯拉磁场中的电化学迁移行为。
Electrochemical migration behavior of moldy printed circuit boards in a 10 mT magnetic field.
作者信息
Liu Xuan, Bai Ziheng, Liu Qianqian, Feng Yali, Dong Chaofang, Lu Lin, Luo Hong, Wang Jirui, Zou Shiwen, Xiao Kui
机构信息
Institute of Advanced Materials and Technology, National Materials Corrosion and Protection Data Center, University of Science and Technology Beijing Beijing 100083 P. R. China
Sichuan Chendu Soil Environmental Material Corrosion National Observation and Research Station Chendu 610062 China.
出版信息
RSC Adv. 2021 Aug 20;11(45):28178-28188. doi: 10.1039/d1ra03776e. eCollection 2021 Aug 16.
In the electrochemical migration behavior (ECM) of printed circuit boards containing mold under a static magnetic field (SMF), the role of the field perpendicular to the electrodes is discussed; the field inhibits the growth and metabolism of mold, while controlling electrochemical diffusion and nucleation. The field indirectly affects the function of mold as a transmission bridge between two electrodes. In this work, the water drop test was used to simulate the adhesion and growth of mold on the circuit board in a humid and hot environment; confocal laser scanning microscopy, scanning electron microscopy, energy dispersive spectroscopy, Raman spectra, and a scanning Kelvin probe were used to analyze the mechanism of static magnetic field and mold on the electrochemical migration.
在含霉菌的印刷电路板在静磁场作用下的电化学迁移行为（ECM）中，讨论了垂直于电极的磁场的作用；该磁场抑制霉菌的生长和代谢，同时控制电化学扩散和成核。该磁场间接影响霉菌作为两个电极之间传输桥梁的功能。在这项工作中，采用水滴试验模拟在湿热环境中霉菌在电路板上的附着和生长；使用共聚焦激光扫描显微镜、扫描电子显微镜、能谱、拉曼光谱和扫描开尔文探针分析静磁场和霉菌对电化学迁移的作用机制。
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