Wu Bo, Huang Jingmeng, Lv Zeman, Cui Ziya, Hu Guanghui, Luo Jiye, Selim Mohamed S, Hao Zhifeng
School of Chemical Engineering and Light Industry, Guangdong University of Technology Guangzhou 510006 P. R. China
Petroleum Application Department, Egyptian Petroleum Research Institute Nasr City 11727 Cairo Egypt.
RSC Adv. 2020 Mar 6;10(17):9768-9776. doi: 10.1039/d0ra00925c.
In order to search for an effective alternative to cyanide for gold plating, mercaptosuccinic acid (MSA) was selected as the complexing agent of Au by open circuit potential tests and gold plating compared with 1-hydroxyethylidene-1,1-diphosphonic acid and aminomethylphosphonic acid. For the first time, a novel, stable, slightly acidic and cyanide-free gold plating bath was prepared. Scanning electron microscopy, Tafel tests, and tin dipping tests showed that the Cu/Ni-P/Au coating had a fine and even grain size, no black pad, good corrosion resistance, and good weldability. Quantum chemical calculations based on density functional theory were used to further study complexants and complexes. Molecular electrostatic potential indicates that Au approaches MSA in the direction of C[double bond, length as m-dash]O. Frontier molecular orbital theory, atomic contribution to orbital composition, condensed local softness, and average local ionization energy indicate that the coordination capacity of the S atom in MSA is much stronger than that of other atoms. Fuzzy bond order analysis shows that the S-Au-S coordination structure is the most stable form in the plating solution. UV-visible absorption spectroscopy clarifies that the wavelength is redshifted when MSA-Au(i) ions form.
为了寻找一种用于镀金的有效替代氰化物的物质,通过开路电位测试和镀金实验,选择巯基琥珀酸(MSA)作为金的络合剂,并与1-羟基亚乙基-1,1-二膦酸和氨基甲基膦酸进行比较。首次制备了一种新型、稳定、微酸性且无氰的镀金液。扫描电子显微镜、塔菲尔测试和浸锡测试表明,Cu/Ni-P/Au镀层具有细小均匀的晶粒尺寸,无黑垫,耐腐蚀性好,焊接性良好。基于密度泛函理论的量子化学计算被用于进一步研究络合剂和络合物。分子静电势表明金朝着C=O的方向靠近MSA。前线分子轨道理论、原子对轨道组成的贡献、凝聚局部软度和平均局部电离能表明,MSA中S原子的配位能力远强于其他原子。模糊键序分析表明,S-Au-S配位结构是镀液中最稳定的形式。紫外可见吸收光谱表明,当MSA-Au(i)离子形成时,波长发生红移。