Yang Linfei, Dai Lidong, Li Heping, Hu Haiying, Liu Kaixiang, Pu Chang, Hong Meiling, Liu Pengfei
Key Laboratory of High-Temperature and High-Pressure Study of the Earth's Interior, Institute of Geochemistry, Chinese Academy of Sciences Guiyang Guizhou 550081 China
University of Chinese Academy of Sciences Beijing 100049 China.
RSC Adv. 2019 Feb 15;9(10):5794-5803. doi: 10.1039/c8ra09441a. eCollection 2019 Feb 11.
In this study, the vibrational and electrical transport properties of molybdenum diselenide were investigated under both non-hydrostatic and hydrostatic conditions up to ∼40.2 GPa using the diamond anvil cell in conjunction with Raman spectroscopy, electrical conductivity, high-resolution transmission electron microscopy, atomic force microscopy, and first-principles theoretical calculations. The results obtained indicated that the semiconductor-to-metal electronic phase transition of MoSe can be extrapolated by some characteristic parameters including abrupt changes in the full width at half maximum of Raman modes, electrical conductivity and calculated bandgap. Under the non-hydrostatic condition, metallization occurred at ∼26.1 GPa and it was irreversible. However, reversible metallization occurred at ∼29.4 GPa under the hydrostatic condition. In addition, the pressure-induced metallization reversibility of MoSe can be revealed by high-resolution transmission electron and atomic force microscopy of the recovered samples under different hydrostatic conditions. This discrepancy in the metallization phenomenon of MoSe in different hydrostatic environments was attributed to the mitigated interlayer van der Waals coupling and shear stress caused by the insertion of pressure medium into the layers.
在本研究中,使用金刚石对顶砧池结合拉曼光谱、电导率、高分辨率透射电子显微镜、原子力显微镜和第一性原理理论计算,在高达约40.2 GPa的非静水和静水条件下研究了二硒化钼的振动和电输运性质。所得结果表明,MoSe的半导体到金属的电子相变可以通过一些特征参数推断,包括拉曼模式半高宽、电导率和计算带隙的突然变化。在非静水条件下,金属化发生在约26.1 GPa,且是不可逆的。然而,在静水条件下,可逆金属化发生在约29.4 GPa。此外,通过对不同静水条件下回收样品的高分辨率透射电子显微镜和原子力显微镜观察,可以揭示MoSe的压力诱导金属化可逆性。MoSe在不同静水环境中的金属化现象差异归因于压力介质插入层间导致的层间范德华耦合和剪切应力的减轻。