Li Hong, Liang Jiakun, Xu Peipei, Luo Jing, Liu Fengbin
College of Mechanical and Material Engineering, North China University of Technology Beijing 100144 P. R. China
Beijing Research Institute of Automation for Machinery Industry Beijing 100120 P. R. China.
RSC Adv. 2020 Jun 2;10(35):20801-20808. doi: 10.1039/d0ra03279d. eCollection 2020 May 27.
The two-dimensional (2D) vertical van der Waals (vdW) stacked homojunction is an advantageous configuration for fast low-power tunneling field effect transistors (TFETs). We simulate the device performance of the sub-10 nm vertical SnSe homojunction TFETs with quantum transport calculations. The vertically stacked device configuration has an effect of decreasing leakage current when compared with its planar counterpart due to the interrupted carrier transport path by the broken connection. A subthreshold swing over four decades (SS) of 44.2-45.8 mV dec and a drain current at SS = 60 mV dec ( ) of 5-7 μA μm are obtained for the optimal vertical SnSe homojunction TFET with = 10 nm at a supply voltage of 0.5-0.74 V. In terms of the device's main figures of merit (, on-state current, intrinsic delay time, and power delay product), the vertical SnSe TFETs and NCTFETs outperform the 2022 and 2028 targets of the International Technology Roadmap for Semiconductors requirements for low-power application (2013 version), respectively.
二维(2D)垂直范德华(vdW)堆叠同质结是用于快速低功耗隧穿场效应晶体管(TFET)的一种有利配置。我们用量子输运计算来模拟亚10纳米垂直SnSe同质结TFET的器件性能。与平面器件相比,垂直堆叠的器件配置由于连接断开导致载流子传输路径中断,具有降低漏电流的效果。对于沟道长度 = 10 nm的最优垂直SnSe同质结TFET,在0.5 - 0.74 V的电源电压下,获得了超过四个数量级的亚阈值摆幅(SS)为44.2 - 45.8 mV/dec,以及在SS = 60 mV/dec时的漏极电流为5 - 7 μA/μm。就器件的主要性能指标(,导通电流、本征延迟时间和功率延迟积)而言,垂直SnSe TFET和NCTFET分别优于《国际半导体技术路线图》(2013版)对低功耗应用的2022年和2028年目标要求。