Nazir Ghazanfar, Rehman Adeela, Park Soo-Jin
Department of Chemistry, Inha University, 100 Inharo, Incheon 22212, Korea.
ACS Appl Mater Interfaces. 2020 Oct 21;12(42):47127-47163. doi: 10.1021/acsami.0c10213. Epub 2020 Oct 6.
Conventional field-effect transistors (FETs) have long been considered a fundamental electronic component for a diverse range of devices. However, nanoelectronic circuits based on FETs are not energy efficient because they require a large supply voltage for switching applications. To reduce the supply voltage in standard FETs, which is hampered by the 60 mV/decade limit established by the subthreshold swing (SS), a new class of FETs have been designed, tunnel FETs (TFETs). A TFET utilizes charge-carrier transportation in device channels using quantum mechanical based band-to-band tunneling despite of conventional thermal injection. The TFETs fabricated with thin semiconducting film or nanowires can attain a 100-fold power drop compared to complementary metal-oxide-semiconductor (CMOS) transistors. As a result, the use of TFETs and CMOS technology together could ameliorate integrated circuits for low-power devices. The discovery of two-dimensional (2D) materials with a diverse range of electronic properties has also opened new gateways for condensed matter physics, nanotechnology, and material science, thus potentially improving TFET-based devices in terms of device design and performance. In this review, state-of-art TFET devices exhibiting different semiconducting channels and geometries are comprehensively reviewed followed by a brief discussion of the challenges that remain for the development of high-performance devices. Lastly, future prospects are presented for the improvement of device design and the working efficiency of TFETs.
传统场效应晶体管(FET)长期以来一直被视为各种设备的基本电子元件。然而,基于FET的纳米电子电路并不节能,因为它们在开关应用中需要较大的电源电压。为了降低标准FET中的电源电压(这受到亚阈值摆幅(SS)所设定的60 mV/十倍频程限制的阻碍),人们设计了一类新型FET,即隧道FET(TFET)。TFET利用基于量子力学的带间隧穿在器件沟道中进行载流子传输,而不是传统的热注入。与互补金属氧化物半导体(CMOS)晶体管相比,用超薄半导体薄膜或纳米线制造的TFET可实现100倍的功耗降低。因此,将TFET和CMOS技术结合使用可以改善低功耗设备的集成电路。具有各种电子特性的二维(2D)材料的发现也为凝聚态物理、纳米技术和材料科学开辟了新的途径,从而有可能在器件设计和性能方面改进基于TFET的设备。在本综述中,我们全面回顾了展现出不同半导体沟道和几何形状的先进TFET器件,随后简要讨论了高性能器件开发中仍然存在的挑战。最后,我们展望了改进TFET器件设计和工作效率的未来前景。