Kacalak Wojciech, Szafraniec Filip, Lipiński Dariusz, Banaszek Kamil, Rypina Łukasz
Faculty of Mechanical Engineering, Koszalin University of Technology, Racławicka 15, 75-620 Koszalin, Poland.
Doctoral School, Koszalin University of Technology, Racławicka 15, 75-620 Koszalin, Poland.
Materials (Basel). 2022 Aug 20;15(16):5751. doi: 10.3390/ma15165751.
In this article, a method of grinding small ceramic elements using hyperboloid and conical grinding wheels was presented. The method allowed for machining with a lower material removal speed and extending the grinding zone without reducing the efficiency of the process. In order to assess the process output parameters, numerical simulations were carried out for single-pass machining. This strategy allows for automation of the process. Grinding with a low material removal speed is recommended for the machining of small and thin elements, since this can avoid fracturing the elements. The methodology for selecting process parameters as well as the results of the abrasive grains activity analyses were presented. The analyses also concerned the roughness of machined surfaces and the variability of their textures. This grinding method was applied in the production of small ceramic elements that are used in the construction of electronic systems, and in the processing of small piezoceramic parts. This grinding technique could also be used in other grinding processes, where the removal of small machining allowances with high efficiency is required.
本文提出了一种使用双曲面和圆锥砂轮磨削小型陶瓷元件的方法。该方法能够以较低的材料去除速度进行加工,并在不降低加工效率的情况下扩展磨削区域。为了评估加工输出参数,对单道次加工进行了数值模拟。这种策略可实现加工过程的自动化。对于小型和薄型元件的加工,建议采用低材料去除速度的磨削方式,因为这样可以避免元件破裂。文中介绍了工艺参数的选择方法以及磨粒活性分析的结果。分析还涉及加工表面的粗糙度及其纹理的变化情况。这种磨削方法应用于电子系统构建中使用的小型陶瓷元件的生产,以及小型压电陶瓷零件的加工。这种磨削技术也可用于其他需要高效去除小加工余量的磨削工艺中。