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基于微型线圈的用于快速固液相互扩散键合的铜锡层局部感应加热

Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils.

作者信息

Hofmann Christian, Satwara Maulik, Kroll Martin, Panhale Sushant, Rochala Patrick, Wiemer Maik, Hiller Karla, Kuhn Harald

机构信息

Fraunhofer Institute for Electronic Nano Systems ENAS, 09126 Chemnitz, Germany.

Center for Microtechnologies, Chemnitz University of Technology, 09126 Chemnitz, Germany.

出版信息

Micromachines (Basel). 2022 Aug 12;13(8):1307. doi: 10.3390/mi13081307.

DOI:10.3390/mi13081307
PMID:36014229
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC9416581/
Abstract

Considering the demand for low temperature bonding in 3D integration and packaging of microelectronic or micromechanical components, this paper presents the development and application of an innovative inductive heating system using micro coils for rapid Cu-Sn solid-liquid interdiffusion (SLID) bonding at chip-level. The design and optimization of the micro coil as well as the analysis of the heating process were carried out by means of finite element method (FEM). The micro coil is a composite material of an aluminum nitride (AlN) carrier substrate and embedded metallic coil conductors. The conductive coil geometry is generated by electroplating of 500 µm thick copper into the AlN carrier. By using the aforementioned micro coil for inductive Cu-Sn SLID bonding, a complete transformation into the thermodynamic stable ε-phase CuSn with an average shear strength of 45.1 N/mm could be achieved in 130 s by applying a bond pressure of 3 MPa. In comparison to conventional bonding methods using conduction-based global heating, the presented inductive bonding approach is characterized by combining very high heating rates of about 180 K/s as well as localized heating and efficient cooling of the bond structures. In future, the technology will open new opportunities in the field of wafer-level bonding.

摘要

考虑到微电子或微机械元件的3D集成与封装中对低温键合的需求，本文介绍了一种创新的感应加热系统的开发与应用，该系统使用微线圈在芯片级实现快速的铜锡固液互扩散（SLID）键合。通过有限元方法（FEM）对微线圈进行了设计与优化，并对加热过程进行了分析。微线圈是由氮化铝（AlN）载体基板和嵌入式金属线圈导体组成的复合材料。导电线圈的几何形状是通过在AlN载体中电镀500 µm厚的铜而形成的。通过使用上述微线圈进行感应铜锡SLID键合，在施加3 MPa的键合压力下，130 s内可实现完全转变为平均剪切强度为45.1 N/mm的热力学稳定ε相CuSn。与使用基于传导的整体加热的传统键合方法相比，所提出的感应键合方法的特点是结合了约180 K/s的非常高的加热速率以及键合结构的局部加热和高效冷却。未来，该技术将为晶圆级键合领域带来新的机遇。

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2
Low-Temperature Cu/SiO Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces.使用（111）取向铜表面实现具有低接触电阻的低温铜/二氧化硅混合键合。
Materials (Basel). 2022 Mar 3;15(5):1888. doi: 10.3390/ma15051888.
3
Wafer-Level Vacuum Packaging of Smart Sensors.智能传感器的晶圆级真空封装。
Sensors (Basel). 2016 Oct 31;16(11):1819. doi: 10.3390/s16111819.