Chae Kisung, Kummel Andrew C, Cho Kyeongjae
Department of Chemistry and Biochemistry, University of California San Diego La Jolla CA USA
Department of Materials Science and Engineering, The University of Texas at Dallas Richardson TX USA
Nanoscale Adv. 2021 Jun 29;3(16):4750-4755. doi: 10.1039/d1na00230a. eCollection 2021 Aug 10.
Density functional theory (DFT) is employed to investigate ferroelectric (FE) hafnium-zirconium oxide stack models for both metal-insulator-metal (MIM) and metal-insulator-semiconductor (MIS) structures. The role of dielectric (DE) interlayers at the ferroelectric interfaces with metals and semiconductors and the effects of thickness scaling of FE and DE layers were investigated using atomic stack models. A high internal field is induced in the FE and DE layers by the FE polarization field which can promote defect generation leading to limited endurance. It is also shown that device operation will be adversely affected by too thick DE interlayers due to high operating voltage. These DFT models elucidate the underlying mechanisms of the lower endurance in experimental MIS devices compared to MIM devices and provide insights into the fundamental mechanisms at the interfaces.
采用密度泛函理论(DFT)研究了金属 - 绝缘体 - 金属(MIM)和金属 - 绝缘体 - 半导体(MIS)结构的铁电(FE)铪锆氧化物堆叠模型。使用原子堆叠模型研究了铁电体与金属和半导体界面处的介电(DE)中间层的作用以及FE层和DE层厚度缩放的影响。FE极化场在FE层和DE层中感应出高内部场,这会促进缺陷产生,导致耐久性受限。研究还表明,由于工作电压高,过厚的DE中间层会对器件运行产生不利影响。这些DFT模型阐明了与MIM器件相比,实验性MIS器件耐久性较低的潜在机制,并为界面处的基本机制提供了见解。