Niciejewska Anna, Ajmal Aleeza, Pawlyta Mirosława, Marczewski Marek, Winiarski Juliusz
Group of Surface Technology, Department of Advanced Material Technologies, Faculty of Chemistry, Wrocław University of Science and Technology, Wybrzeże Wyspiańskiego 27, 50-370, Wrocław, Poland.
Materials Research Laboratory, Faculty of Mechanical Engineering, Silesian University of Technology, Konarskiego 18A, 44-100, Gliwice, Poland.
Sci Rep. 2022 Nov 2;12(1):18531. doi: 10.1038/s41598-022-22007-4.
Ni-Mo alloy coatings were deposited on a copper base material from a non-aqueous plating bath based on a deep eutectic solvent (DES) of choline chloride and propylene glycol in a 1:2 molar ratio containing 0.2 mol dm NiCl · 6HO and 0.01 mol dm (NH)MoO·4HO. Uniform and adherent Ni-Mo deposits with a nodular morphology were obtained at all the deposition potentials investigated (from - 0.5 to - 0.9 V vs. Ag). By shifting the potential from - 0.5 to - 0.9 V, the deposition current density increased from - 0.4 to - 1.5 mA cm and the overall surface roughness increased. It was also accompanied by an increase in the Mo content from ~ 7 to ~ 13 wt% in the potential range from - 0.5 to - 0.7 V. A further change in the potential from - 0.8 to - 0.9 V caused a decrease in the Mo content to ~ 10 wt% and a deterioration in the quality of the coating. For the most uniform coating, deposited at - 0.6 V and having a thickness of ca. 660 nm, the crystallite size did not exceed 10 nm. With the content of Ni (89 at.%) and Mo (11 at.%), the selected area electron diffraction (SAED) analysis allowed us to identify the cubic phase NiMo. The corrosion resistance of Ni-Mo coatings in 0.05 mol dm NaCl solution generally increased during exposure of 18 h, as evidenced by ever higher polarization resistance. Finally, regardless of the applied deposition potential, low corrosion currents (in the range of 0.1-0.3 μA cm) have been measured for the coatings. EIS revealed that charge transfer resistances were the highest (57-67 kΩ cm) for coatings deposited at - 0.5 V, - 0.6 V and - 0.7 V. Further increase in the deposition potential in the negative direction was unfavorable.
基于氯化胆碱和丙二醇摩尔比为1:2的低共熔溶剂（DES），在含有0.2 mol dm⁻³ NiCl₂·6H₂O和0.01 mol dm⁻³ (NH₄)₆Mo₇O₂₄·4H₂O的非水镀液中，将镍钼合金涂层沉积在铜基材料上。在所有研究的沉积电位（相对于银为 -0.5至 -0.9 V）下，均获得了具有结节形态的均匀且附着良好的镍钼沉积物。通过将电位从 -0.5 V 变为 -0.9 V，沉积电流密度从 -0.4 mA cm⁻²增加到 -1.5 mA cm⁻²，并且整体表面粗糙度增加。在 -0.5至 -0.7 V的电位范围内，钼含量也从约7 wt%增加到约13 wt%。电位从 -0.8 V进一步变化到 -0.9 V导致钼含量降至约10 wt%，并且涂层质量恶化。对于在 -0.6 V沉积且厚度约为660 nm 的最均匀涂层，微晶尺寸不超过10 nm。镍含量为89 at.%，钼含量为11 at.%，通过选区电子衍射（SAED）分析，我们能够确定立方相NiMo。在0.05 mol dm⁻³ NaCl溶液中，镍钼涂层的耐腐蚀性在18小时的暴露过程中总体上有所增加，更高的极化电阻证明了这一点。最后，无论施加的沉积电位如何，涂层的腐蚀电流都很低（在0.1 - 0.3 μA cm⁻²范围内）。电化学阻抗谱（EIS）显示，在 -0.5 V、 -0.6 V和 -0.7 V沉积的涂层的电荷转移电阻最高（57 - 67 kΩ cm²）。沉积电位在负方向上的进一步增加是不利的。
