Lin Zhifan, Hu Hao, Dai Yifan, Yaoyu Zhong, Xue Shuai
Opt Express. 2022 Dec 19;30(26):46157-46169. doi: 10.1364/OE.477392.
Magnetorheological finishing (MRF) is a sub-aperture polishing process, which is often used to correct surface errors and remove sub-surface damage after grinding. A strong correlation exists between the material removal rate and surface roughness in MRF, but current theoretical models are incapable of predicting these two factors at the same time. In this paper, a theoretical model was developed to describe the material removal rate and surface quality after MRF in order to better understand the material removal mechanism of MRF and explain the relationship between surface roughness and material removal rate. Two modes of experiments (uniform polishing and fixed point polishing) were conducted on monocrystalline silicon to obtain the results of surface roughness and removal rate. The experimental results are highly consistent with the theoretical model calculated results. The theoretical model could be a reference for high-efficiency and ultra-smooth MRF process.
磁流变抛光（MRF）是一种子孔径抛光工艺，常用于磨削后校正表面误差和去除亚表面损伤。在磁流变抛光中，材料去除率与表面粗糙度之间存在很强的相关性，但目前的理论模型无法同时预测这两个因素。本文建立了一个理论模型来描述磁流变抛光后的材料去除率和表面质量，以便更好地理解磁流变抛光的材料去除机理，并解释表面粗糙度与材料去除率之间的关系。在单晶硅上进行了两种实验模式（均匀抛光和定点抛光），以获得表面粗糙度和去除率的结果。实验结果与理论模型计算结果高度一致。该理论模型可为高效超光滑磁流变抛光工艺提供参考。
