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液态金属赋能的贴合式电子器件。

Liquid metal enabled conformal electronics.

作者信息

Ping Bingyi, Zhou Guanxi, Zhang Zihang, Guo Rui

机构信息

Department of Biomedical Engineering, Tianjin University, Tianjin, China.

出版信息

Front Bioeng Biotechnol. 2023 Feb 3;11:1118812. doi: 10.3389/fbioe.2023.1118812. eCollection 2023.

Abstract

The application of three-dimensional common electronics that can be directly pasted on arbitrary surfaces in the fields of human health monitoring, intelligent robots and wearable electronic devices has aroused people's interest, especially in achieving stable adhesion of electronic devices on biological dynamic three-dimensional interfaces and high-quality signal acquisition. In recent years, liquid metal (LM) materials have been widely used in the manufacture of flexible sensors and wearable electronic devices because of their excellent tensile properties and electrical conductivity at room temperature. In addition, LM has good biocompatibility and can be used in a variety of biomedical applications. Here, the recent development of LM flexible electronic printing methods for the fabrication of three-dimensional conformal electronic devices on the surface of human tissue is discussed. These printing methods attach LM to the deformable substrate in the form of bulk or micro-nano particles, so that electronic devices can adapt to the deformation of human tissue and other three-dimensional surfaces, and maintain stable electrical properties. Representative examples of applications such as self-healing devices, degradable devices, flexible hybrid electronic devices, variable stiffness devices and multi-layer large area circuits are reviewed. The current challenges and prospects for further development are also discussed.

摘要

可直接粘贴在任意表面的三维通用电子器件在人体健康监测、智能机器人和可穿戴电子设备领域的应用引起了人们的兴趣,尤其是在实现电子设备在生物动态三维界面上的稳定粘附以及高质量信号采集方面。近年来,液态金属(LM)材料因其优异的拉伸性能和室温下的导电性,已被广泛应用于柔性传感器和可穿戴电子设备的制造。此外,液态金属具有良好的生物相容性,可用于多种生物医学应用。在此,讨论了用于在人体组织表面制造三维共形电子器件的液态金属柔性电子印刷方法的最新进展。这些印刷方法将液态金属以块状或微纳米颗粒的形式附着到可变形基板上,使电子设备能够适应人体组织和其他三维表面的变形,并保持稳定的电学性能。综述了自愈器件、可降解器件、柔性混合电子器件、可变刚度器件和多层大面积电路等应用的代表性实例。还讨论了当前面临的挑战和进一步发展的前景。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/04d4/9935617/8cba5d08e014/fbioe-11-1118812-g001.jpg

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