Li Min, Chen Da, Deng Xiupeng, Xu Baochun, Li Mingyue, Liang Hongrui, Wang Mengxin, Song Ge, Zhang Tong, Liu Yijian
College of Electronic and Information Engineering, Shandong University of Science and Technology, 266590 Qingdao, China.
ACS Appl Mater Interfaces. 2023 Mar 22;15(11):14948-14957. doi: 10.1021/acsami.2c23002. Epub 2023 Mar 9.
Hybrid rigid-soft electronic system combines the biocompatibility of stretchable electronics and the computing capacity of silicon-based chips, which has a chance to realize a comprehensive stretchable electronic system with perception, control, and algorithm in near future. However, a reliable rigid-soft interconnection interface is urgently required to ensure both the conductivity and stretchability under a large strain. To settle this demand, this paper proposes a graded Mxene-doped liquid metal (LM) method to achieve a stable solid-liquid composite interconnect (SLCI) between the rigid chip and stretchable interconnect lines. To overcome the surface tension of LM, a high-conductive Mxene is doped for the balance between adhesion and liquidity of LM. And the high-concentration doping could prevent the contact failure with chip pins, while the low-concentration doping tends to maintain the stretchability. Based on this dosage-graded interface structure, the solid light-emitting diode (LED) and other devices integrated into the stretchable hybrid electronic system could achieve an excellent conductivity insensitive to the exerted tensile strain. In addition, the hybrid electronic system is demonstrated for skin-mounted and tire-mounted temperature-test applications under the tensile strain up to 100%. This Mxene-doped LM method aims to obtain a robust interface between rigid components and flexible interconnects by attenuating the inherent Young's modulus mismatch between rigid and flexible systems and makes it a promising candidate for effective interconnection between solid electronics and soft electronics.
混合刚性-柔性电子系统结合了可拉伸电子器件的生物相容性和硅基芯片的计算能力，有望在不久的将来实现一个具备感知、控制和算法功能的全面可拉伸电子系统。然而，迫切需要一个可靠的刚性-柔性互连接口，以确保在大应变下的导电性和可拉伸性。为满足这一需求，本文提出一种梯度掺杂MXene的液态金属（LM）方法，以在刚性芯片和可拉伸互连线之间实现稳定的固-液复合互连（SLCI）。为克服液态金属的表面张力，掺杂高导电性的MXene以平衡液态金属的附着力和流动性。高浓度掺杂可防止与芯片引脚的接触失效，而低浓度掺杂则倾向于保持可拉伸性。基于这种剂量梯度的界面结构，集成到可拉伸混合电子系统中的固态发光二极管（LED）和其他器件能够实现优异的导电性，且对施加的拉伸应变不敏感。此外，该混合电子系统在高达100%的拉伸应变下进行了皮肤贴装和轮胎贴装温度测试应用的演示。这种掺杂MXene的液态金属方法旨在通过减弱刚性和柔性系统之间固有的杨氏模量不匹配，在刚性部件和柔性互连之间获得一个坚固的界面，并使其成为固态电子器件和柔性电子器件之间有效互连的一个有前途的候选方案。
