Department of Microbiology & Immunology, Columbia University Irving Medical Center, New York, NY 10032, USA.
Department of Biology, Institute of Biochemistry, Eidgenössische Technische Hochschule (ETH), 8093 Zürich, Switzerland; Institute for Research in Biomedicine, Università della Svizzera italiana (USI), Faculty of Biomedical Sciences, 6500 Bellinzona, Switzerland.
Mol Cell. 2023 Apr 20;83(8):1237-1250.e15. doi: 10.1016/j.molcel.2023.02.010. Epub 2023 Mar 13.
DNA double-strand breaks (DSBs) are cytotoxic genome lesions that must be accurately and efficiently repaired to ensure genome integrity. In yeast, the Mre11-Rad50-Xrs2 (MRX) complex nicks 5'-terminated DSB ends to initiate nucleolytic processing of DSBs for repair by homologous recombination. How MRX-DNA interactions support 5' strand-specific nicking and how nicking is influenced by the chromatin context have remained elusive. Using a deep sequencing-based assay, we mapped MRX nicks at single-nucleotide resolution next to multiple DSBs in the yeast genome. We observed that the DNA end-binding Ku70-Ku80 complex directed DSB-proximal nicks and that repetitive MRX cleavage extended the length of resection tracts. We identified a sequence motif and a DNA meltability profile that is preferentially nicked by MRX. Furthermore, we found that nucleosomes as well as transcription impeded MRX incisions. Our findings suggest that local DNA sequence and chromatin features shape the activity of this central DSB repair complex.
DNA 双链断裂 (DSBs) 是细胞毒性的基因组损伤,必须准确有效地修复,以确保基因组的完整性。在酵母中,Mre11-Rad50-Xrs2(MRX)复合物在 5' 端切割 DSB 末端,以启动 DSB 的核酸酶加工,通过同源重组进行修复。MRX-DNA 相互作用如何支持 5' 链特异性切割,以及切割如何受到染色质环境的影响,一直难以捉摸。我们使用基于深度测序的测定法,以单核苷酸分辨率绘制了酵母基因组中多个 DSB 附近的 MRX 切口。我们观察到 DNA 末端结合的 Ku70-Ku80 复合物指导 DSB 近端切口,并且重复的 MRX 切割延长了切除片段的长度。我们鉴定了一个序列基序和一个 DNA 融解性图谱,该图谱被 MRX 优先切割。此外,我们发现核小体以及转录会阻碍 MRX 切口。我们的研究结果表明,局部 DNA 序列和染色质特征塑造了这个中央 DSB 修复复合物的活性。