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DFT 指导的配体设计助力室温下的 Cu 催化芳基溴代物的氨化反应。

Room-Temperature Cu-Catalyzed Amination of Aryl Bromides Enabled by DFT-Guided Ligand Design.

机构信息

Department of Chemistry, Massachusetts Institute of Technology, 77 Massachusetts Ave., Cambridge, Massachusetts 02139, United States.

出版信息

J Am Chem Soc. 2023 Mar 29;145(12):6966-6975. doi: 10.1021/jacs.3c00500. Epub 2023 Mar 16.

Abstract

Ullmann-type C-N coupling reactions represent an important alternative to well-established Pd-catalyzed approaches due to the differing reactivity and the lower cost of Cu. While the design of anionic Cu ligands, particularly those by Ma, has enabled the coupling of various classes of aryl halides and alkyl amines, most methods require conditions that can limit their utility on complex substrates. Herein, we disclose the development of anionic ,-diarylbenzene-1,2-diamine ligands that promote the Cu-catalyzed amination of aryl bromides under mild conditions. Guided by DFT calculations, these ligands were designed to (1) increase the electron density on Cu, thereby increasing the rate of oxidative addition of aryl bromides, and (2) stabilize the active anionic Cu complex a π-interaction. Under optimized conditions, structurally diverse aryl and heteroaryl bromides and a broad range of alkyl amine nucleophiles, including pharmaceuticals bearing multiple functional groups, were efficiently coupled at room temperature. Combined computational and experimental studies support a mechanism of C-N bond formation that follows a catalytic cycle akin to the well-explored Pd-catalyzed variants. Modification of the ligand structure to include a naphthyl residue resulted in a lower energy barrier to oxidative addition, providing a 30-fold rate increase relative to what is seen with other ligands. Collectively, these results establish a new class of anionic ligands for Cu-catalyzed C-N couplings, which we anticipate may be extended to other Cu-catalyzed C-heteroatom and C-C bond-forming reactions.

摘要

乌尔曼型 C-N 偶联反应是对成熟的 Pd 催化方法的重要替代,因为 Cu 的反应性不同且成本更低。虽然 Ma 设计的阴离子 Cu 配体,特别是那些设计的阴离子 Cu 配体,已经能够使各种芳基卤化物和烷基胺偶联,但大多数方法需要的条件可能会限制它们在复杂底物上的应用。在此,我们公开了阴离子,-二芳基苯-1,2-二胺配体的开发,该配体在温和条件下促进 Cu 催化的芳基溴化物的氨化。受 DFT 计算的指导,这些配体被设计为(1)增加 Cu 上的电子密度,从而增加芳基溴化物的氧化加成速率,和(2)稳定活性阴离子 Cu 配合物 a 的π 相互作用。在优化条件下,结构多样的芳基和杂芳基溴化物以及广泛的烷基胺亲核试剂,包括含有多个官能团的药物,在室温下高效偶联。计算和实验研究的结合支持 C-N 键形成的机理遵循类似于广泛探索的 Pd 催化变体的催化循环。将配体结构修饰为包含萘基残基,导致氧化加成的能垒降低,与其他配体相比,速率提高了 30 倍。总的来说,这些结果为 Cu 催化的 C-N 偶联建立了一类新的阴离子配体,我们预计它们可以扩展到其他 Cu 催化的 C-杂原子和 C-C 键形成反应。

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