Zhang Guangsheng, Wang Chenghao, Jiang Lingmei, Wang Yibo, Wang Bing, Wang Xiaoxu, Liu Haoran, Zong Lishuai, Wang Jinyan, Jian Xigao
School of Chemical Engineering, Dalian University of Technology, Dalian 116024, China.
State Key Laboratory of Fine Chemicals, Dalian University of Technology, Dalian 116024, China.
Polymers (Basel). 2023 Mar 20;15(6):1531. doi: 10.3390/polym15061531.
The photosensitive resins for 3D printing technology have been widely applied throughout the advanced communication field due to their merits of high molding accuracy and fast processing speed. Regardless, they, in particular, should have better mechanical properties, heat resistance, and dielectric properties. Herein, photocurable fluorinated poly (phthalazinone ether) (FSt-FPPE) was utilized as a prepolymer to improve the performance of photosensitive resin. A series of UV-curable inks named FST/DPGs were prepared with FSt-FPPE and acrylic diluents of different mass fractions. The FST/DPGs were cured into films by UV curing and post-treatment. After curing, their properties were characterized in detail. In terms of heat resistance, glass transition temperature () could reach 233 °C and the 5% thermal decomposition temperature () was 371 °C. The tensile strength surprisingly reached 61.5 MPa, and the dielectric constant () could be significantly reduced to 2.75. Additionally, FST/DPGs were successfully employed in UV-assisted direct writing (DIW) to print 3D objects that benefited from their commendable fluidity and rapid curing speed. A stiff cylinder sample with a smooth surface and distinct pattern was ultimately obtained, indicating their remarkable 3D printing adaptation. Such photosensitive resin for UV-assisted DIW exhibits tremendous potential in the electronic industry.
用于3D打印技术的光敏树脂因其成型精度高、加工速度快等优点，已在先进通信领域得到广泛应用。尽管如此，它们尤其应具备更好的机械性能、耐热性和介电性能。在此，光固化氟化聚（酞嗪酮醚）（FSt-FPPE）被用作预聚物来改善光敏树脂的性能。用FSt-FPPE和不同质量分数的丙烯酸稀释剂制备了一系列名为FST/DPGs的紫外光固化油墨。通过紫外光固化和后处理将FST/DPGs固化成膜。固化后，对其性能进行了详细表征。在耐热性方面，玻璃化转变温度（）可达233℃，5%热分解温度（）为371℃。拉伸强度惊人地达到61.5MPa，介电常数（）可显著降低至2.75。此外，FST/DPGs成功应用于紫外光辅助直接书写（DIW），以打印3D物体，这得益于它们良好的流动性和快速的固化速度。最终获得了一个表面光滑、图案清晰的刚性圆柱体样品，表明它们具有出色的3D打印适应性。这种用于紫外光辅助DIW的光敏树脂在电子工业中展现出巨大潜力。
