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MXene 接触工程在印刷电子学中的应用。

MXene Contact Engineering for Printed Electronics.

机构信息

School of Materials Science and Engineering, Zhengzhou Key Laboratory of Flexible Electronic Materials and Thin-Film Technologies, Zhengzhou University, Zhengzhou, 450001, P. R. China.

Henan Innovation Center for Functional Polymer Membrane Materials, Xinxiang, 453000, P. R. China.

出版信息

Adv Sci (Weinh). 2023 Jul;10(19):e2207174. doi: 10.1002/advs.202207174. Epub 2023 Apr 25.

DOI:10.1002/advs.202207174
PMID:37096843
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC10323642/
Abstract

MXenes emerging as an amazing class of 2D layered materials, have drawn great attention in the past decade. Recent progress suggest that MXene-based materials have been widely explored as conductive electrodes for printed electronics, including electronic and optoelectronic devices, sensors, and energy storage systems. Here, the critical factors impacting device performance are comprehensively interpreted from the viewpoint of contact engineering, thereby giving a deep understanding of surface microstructures, contact defects, and energy level matching as well as their interaction principles. This review also summarizes the existing challenges of MXene inks and the related printing techniques, aiming at inspiring researchers to develop novel large-area and high-resolution printing integration methods. Moreover, to effectually tune the states of contact interface and meet the urgent demands of printed electronics, the significance of MXene contact engineering in reducing defects, matching energy levels, and regulating performance is highlighted. Finally, the printed electronics constructed by the collaborative combination of the printing process and contact engineering are discussed.

摘要

MXenes 作为一类新兴的二维层状材料,在过去十年中引起了极大的关注。最近的研究进展表明,基于 MXene 的材料已被广泛探索作为印刷电子的导电电极,包括电子和光电设备、传感器和储能系统。在这里,从接触工程的角度综合解释了影响器件性能的关键因素,从而深入了解表面微观结构、接触缺陷以及能级匹配及其相互作用原理。本综述还总结了 MXene 油墨和相关印刷技术中存在的挑战,旨在激发研究人员开发新型大面积和高分辨率的印刷集成方法。此外,为了有效地调节接触界面的状态,满足印刷电子的迫切需求,突出了 MXene 接触工程在减少缺陷、匹配能级和调节性能方面的重要性。最后,讨论了通过印刷工艺和接触工程的协同组合构建的印刷电子产品。

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