Guo Jianming, Wang Hao, Zhang Caixia, Zhang Qilong, Yang Hui
School of Materials Science and Engineering, State Key Lab Silicon Mat, Zhejiang University, Hangzhou 310027, China.
Jiaxing Glead Elect Co Ltd., Jiaxing 314003, China.
Polymers (Basel). 2020 Aug 20;12(9):1875. doi: 10.3390/polym12091875.
Copper clad laminates (CCLs) with low dissipation factor (Df) are urgently needed in the fields of high-frequency communications devices. A novel resin matrix of modified poly (2,6-dimethyl-1,4-phenylene ether) (MPPE) and styrene-ethylene/butylene-styrene (SEBS) was employed in the fabrication of high-frequency copper clad laminates (CCLs). The composites were reinforced by E-glass fabrics, which were modified with phenyltriethoxysilane (PhTES). The composite laminates obtained exhibited impressive dielectric loss of 0.0027 at 10 GHz when the weight ratio of MPPE to SEBS was 5:1. In order to modify the dielectric constant (Dk), coefficient of thermal expansion (CTE) and other performances of laminates, LiTiO (LT) ceramic powders were introduced into the resin matrix. The composite laminates showed low dielectric loss of 0.0026 at 10 GHz and relatively high flexural strength of 125 MPa when the mass ratio of LT fillers to resin is 0.4. Moreover, the composite laminates all maintain low water uptake (<0.5%). The microstructure and thermal properties of composite laminates filled with LT ceramic powders were also tested. These results show that copper clad laminates prepared with modified polyphenylene ether (MPPE)/SEBS and LT ceramic fillers have strong competitiveness to fabricate printed circuit boards (PCBs) for high-frequency and high-speed applications.
高频通信设备领域迫切需要低损耗因子（Df）的覆铜箔层压板（CCL）。一种新型的由改性聚（2,6-二甲基-1,4-亚苯基醚）（MPPE）和苯乙烯-乙烯/丁烯-苯乙烯（SEBS）组成的树脂基体被用于制造高频覆铜箔层压板（CCL）。该复合材料由用苯基三乙氧基硅烷（PhTES）改性的E玻璃纤维织物增强。当MPPE与SEBS的重量比为5:1时，所得复合层压板在10 GHz时表现出令人印象深刻的0.0027的介电损耗。为了改变层压板的介电常数（Dk）、热膨胀系数（CTE）和其他性能，将钛酸锂（LT）陶瓷粉末引入树脂基体中。当LT填料与树脂的质量比为0.4时，复合层压板在10 GHz时显示出0.0026的低介电损耗和125 MPa的相对较高的弯曲强度。此外，复合层压板的吸水率均保持在较低水平（<0.5%）。还测试了填充LT陶瓷粉末的复合层压板的微观结构和热性能。这些结果表明，用改性聚苯醚（MPPE）/SEBS和LT陶瓷填料制备的覆铜箔层压板在制造用于高频和高速应用的印刷电路板（PCB）方面具有很强的竞争力。
