Laboratory for Design of Microsystems, IMTEK-University of Freiburg, 79106 Freiburg im Breisgau, Germany.
Sensors (Basel). 2023 Apr 25;23(9):4248. doi: 10.3390/s23094248.
In this paper, we present an innovative manufacturing process for the production of capacitive pressure and force sensors with excellent thermal stability for high-temperature applications. The sensors, which are manufactured from a stack of two silicon chips mounted via with gold-silicon (Au-Si) or aluminum-silicon (Al-Si) eutectic bonding, are shielded, miniaturized, and allow an operating temperature of up to 500 °C. Compared to conventional methods, the greatest benefit of the manufacturing process is that different sensor dimensions can be produced in the same batch for a wide measuring range, from mN to kN. The characterization of the realized sensors shows a high linearity and a low temperature drift of 99.992% FS and -0.001% FS/K at 350 °C, as well as a nonlinearity of 0.035% FS and a temperature drift of -0.0027% FS/K at 500 °C.
本文提出了一种创新的制造工艺,用于生产具有出色热稳定性的电容式压力和力传感器,可用于高温应用。该传感器由通过金硅(Au-Si)或铝硅(Al-Si)共晶键合安装的两个硅芯片堆叠而成,具有屏蔽、小型化的特点,工作温度可达 500°C。与传统方法相比,制造工艺的最大优势在于可以在同一批次中生产不同尺寸的传感器,以实现广泛的测量范围,从毫牛到千牛。所实现的传感器的特性表明,在 350°C 时具有 99.992% FS 和 -0.001% FS/K 的高线性度和低温度漂移,以及 0.035% FS 的非线性度和 -0.0027% FS/K 的温度漂移。