Sakharov Alexei V, Arteev Dmitri S, Zavarin Evgenii E, Nikolaev Andrey E, Lundin Wsevolod V, Prasolov Nikita D, Yagovkina Maria A, Tsatsulnikov Andrey F, Fedotov Sergey D, Sokolov Evgenii M, Statsenko Vladimir N
Submicron Heterostructures for Microelectronics, Research and Engineering Center, RAS, 26 Politekhnicheskaya, 194021 Saint-Petersburg, Russia.
Ioffe Institute, 26 Politekhnicheskaya, 194021 Saint-Petersburg, Russia.
Materials (Basel). 2023 Jun 8;16(12):4265. doi: 10.3390/ma16124265.
A complex study was performed on a set of AlGaN/GaN high-electron-mobility transistor structures grown by metalorganic vapor phase epitaxy on miscut Si(111) wafers with a highly resistive epitaxial Si layer to investigate the influence of substrate miscut on their properties. The results showed that wafer misorientation had an influence on the strain evolution during the growth and surface morphology, and could have a strong impact on the mobility of 2D electron gas, with a weak optimum at 0.5° miscut angle. A numerical analysis revealed that the interface roughness was a main parameter responsible for the variation in electron mobility.
对通过金属有机气相外延生长在具有高电阻外延硅层的错切Si(111)晶片上的一组AlGaN/GaN高电子迁移率晶体管结构进行了一项复杂的研究,以研究衬底错切对其性能的影响。结果表明,晶片的取向错误对生长过程中的应变演化和表面形态有影响,并且可能对二维电子气的迁移率产生强烈影响,在0.5°错切角时有一个较弱的最佳值。数值分析表明,界面粗糙度是导致电子迁移率变化的主要参数。