Poliakov Maksim, Kovalev Dmitry, Vadchenko Sergei, Moskovskikh Dmitry, Kiryukhantsev-Korneev Philipp, Volkova Lidiya, Dudin Alexander, Orlov Andrey, Goryachev Andrey, Rogachev Alexander
Merzhanov Institute of Structural Macrokinetics and Materials Science, Russian Academy of Sciences (ISMAN), Chernogolovka 142432, Russia.
Institute of Nanotechnology of Microelectronics of the Russian Academy of Sciences, Moscow 119991, Russia.
Nanomaterials (Basel). 2023 Jul 4;13(13):2004. doi: 10.3390/nano13132004.
High-entropy alloys are promising materials for novel thin-film resistors since they have high resistivity and a low-temperature coefficient of resistivity (TCR). In this work, a new high-entropy thin-film CoCrFeNiTi was deposited on a Si/SiO substrate by means of magnetron sputtering of the multi-component target produced by hot pressing of the powder mixture. The samples possessed a thickness of 130-230 nm and an amorphous atomic structure with nanocrystallite traces. This structure persisted after being annealed up to 400 °C, which was confirmed using X-ray and electron diffraction. The film had a single-phase structure with a smooth surface and a uniform distribution of all elements. The obtained film served for microresistor elaboration, which was produced using the lithography technique and tested in a temperature range from -60 °C up to 200 °C. Resistivity at room temperature was estimated as 2.37 μOhm·m. The results have demonstrated that TCR depends on temperature according to the simple linear law in a range from -60 °C up to 130 °C, changing its value from -78 ppm/°C at low temperatures to -6.6 ppm/°C at 130 °C. Such characteristics show the possibility of using these high-entropy alloy films for resistive elements in contemporary and future micro-electronic devices.
高熵合金是用于新型薄膜电阻器的有前途的材料,因为它们具有高电阻率和低电阻率温度系数(TCR)。在这项工作中,通过对粉末混合物进行热压制备的多组分靶材进行磁控溅射,在Si/SiO衬底上沉积了一种新型高熵薄膜CoCrFeNiTi。样品厚度为130 - 230nm,具有带有纳米微晶痕迹的非晶原子结构。这种结构在高达400°C退火后仍然存在,这通过X射线和电子衍射得到证实。该薄膜具有单相结构,表面光滑且所有元素分布均匀。所制备的薄膜用于制造微电阻器,该微电阻器采用光刻技术制造,并在-60°C至200°C的温度范围内进行测试。室温下的电阻率估计为2.37μΩ·m。结果表明,在-60°C至130°C的范围内,TCR根据简单的线性规律随温度变化,其值从低温下的-78ppm/°C变化到130°C时的-6.6ppm/°C。这些特性表明了在当代和未来微电子器件中使用这些高熵合金薄膜作为电阻元件的可能性。