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TI-LGAD 技术的全面特性描述。

A Comprehensive Characterization of the TI-LGAD Technology.

机构信息

Physics Institute, University of Zurich, Irchel Campus, 8057 Zurich, Switzerland.

Fondazione Bruno Kessler (FBK), 38123 Trento, Italy.

出版信息

Sensors (Basel). 2023 Jul 7;23(13):6225. doi: 10.3390/s23136225.

Abstract

Pixelated low-gain avalanche diodes (LGADs) can provide both precision spatial and temporal measurements for charged particle detection; however, electrical termination between the pixels yields a no-gain region, such that the active area or is not sufficient for small pixel sizes. Trench-isolated LGADs (TI-LGADs) are a strong candidate for solving the fill-factor problem, as the p-stop termination structure is replaced by isolated trenches etched in the silicon itself. In the TI-LGAD process, the p-stop termination structure, typical of LGADs, is replaced by isolating trenches etched in the silicon itself. This modification substantially reduces the size of the no-gain region, thus enabling the implementation of small pixels with an adequate fill factor value. In this article, a systematic characterization of the TI-RD50 production, the first of its kind entirely dedicated to the TI-LGAD technology, is presented. Designs are ranked according to their measured inter-pixel distance, and the time resolution is compared against the regular LGAD technology.

摘要

像素化低增益雪崩二极管 (LGAD) 可提供用于带电粒子检测的精确空间和时间测量;然而,像素之间的电气端接会产生无增益区域,因此对于小像素尺寸,有效面积 不足。沟槽隔离 LGAD (TI-LGAD) 是解决填充因子问题的有力候选者,因为 p 型截止终止结构被刻蚀在硅本身中的隔离沟槽所取代。在 TI-LGAD 工艺中,典型的 LGAD 的 p 型截止终止结构被刻蚀在硅本身中的隔离沟槽所取代。这种改进大大减小了无增益区域的尺寸,从而能够实现具有足够填充因子值的小像素。在本文中,介绍了首次完全针对 TI-LGAD 技术的 TI-RD50 生产的系统特性。根据测量的像素间距离对设计进行排名,并将时间分辨率与常规 LGAD 技术进行比较。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/b554/10346973/a13b8c3ba154/sensors-23-06225-g001.jpg

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