Sung Yongjin, Wang Weizhong
Opt Lett. 2023 Aug 1;48(15):3993-3996. doi: 10.1364/OL.498290.
We demonstrate hyperspectral confocal microscopy in the short-wave infrared (SWIR) range of 1100-1600 nm using a wavelength-scanning laser in tandem with laser scanning confocal microscopy. Confocal microscopy in the SWIR range allows for high-resolution inspection of an integrated circuit (IC) chip, while hyperspectral imaging, together with a chemometric analysis, enables us to identify functional circuit block groups in the acquired image. With the extended capability, the developed instrument can be potentially used for inline inspection and non-invasive failure analysis of IC chips.
我们使用波长扫描激光器与激光扫描共聚焦显微镜相结合，展示了在1100 - 1600纳米短波红外（SWIR）范围内的高光谱共聚焦显微镜技术。SWIR范围内的共聚焦显微镜可对集成电路（IC）芯片进行高分辨率检测，而高光谱成像与化学计量分析相结合，使我们能够在获取的图像中识别功能电路块组。凭借这一扩展功能，所开发的仪器有可能用于IC芯片的在线检测和非侵入式故障分析。
