Liu Shuangjie, Li Xingwang, Hao Yongping, Li Xing, Liu Fengli
School of Equipment Engineering, Shenyang Ligong University, Shenyang 110159, China.
School of Mechanical Engineering, Shenyang Ligong University, Shenyang 110159, China.
Micromachines (Basel). 2023 Jul 31;14(8):1539. doi: 10.3390/mi14081539.
The performance of supercapacitors is directly influenced by the conductivity of polypyrrole, which serves as the electrode material. In order to balance considerations of cost-effectiveness and conductivity, this study employs magnetron sputtering to fabricate a copper-tin alloy layer as the conductive layer for polypyrrole. The deposition of a copper-tin alloy film through magnetron sputtering has a significant impact on the polymerization effect of pyrrole as well as being a crucial factor influencing the performance of supercapacitors. Various parameters, including working pressure, sputtering time, and sputtering power, affect the conductivity of the copper-tin alloy film. Furthermore, the degree of influence of each parameter on the conductivity of the copper-tin alloy film varies. This study utilizes an orthogonal experimental design to investigate the impact of various factors and levels on the conductivity and uniformity of a metal film. The objective is to optimize the process parameters for the creation of a copper-tin alloy film with desirable characteristics. Experimental results indicate that the working voltage, sputtering time, and sputtering power significantly influence the coefficient of variation, deposition rate, target current, and operating voltage of the film. Furthermore, FT-IR, XRD, and SEM tests are conducted on samples prepared using the identified optimal process parameters. In addition, we demonstrate various approaches to enhance the experiment's reliability. The findings indicate that the most favorable process parameters for achieving optimal results are a working pressure of 0.065 Pa, a sputtering time of 20 min, and a sputtering power of 70 W. It was observed that the sputtering time significantly influences the uniformity of the copper-tin alloy film, whereas the sputtering power has a minimal impact on its uniformity. The deposition rate is primarily influenced by the working pressure, with the greatest effect observed. Conversely, the sputtering time has the least impact on the deposition rate. Similarly, the target current is predominantly affected by the sputtering power, exhibiting the greatest influence, while the sputtering time has the least effect. Furthermore, the working voltage is most significantly influenced by the working pressure, whereas the sputtering time has the least impact on the working voltage.
超级电容器的性能直接受到用作电极材料的聚吡咯导电性的影响。为了平衡成本效益和导电性的考量，本研究采用磁控溅射法制备铜锡合金层作为聚吡咯的导电层。通过磁控溅射沉积铜锡合金膜对吡咯的聚合效果有显著影响，也是影响超级电容器性能的关键因素。包括工作压力、溅射时间和溅射功率在内的各种参数会影响铜锡合金膜的导电性。此外，每个参数对铜锡合金膜导电性的影响程度各不相同。本研究利用正交实验设计来探究各种因素和水平对金属膜导电性和均匀性的影响。目的是优化制备具有理想特性的铜锡合金膜的工艺参数。实验结果表明，工作电压、溅射时间和溅射功率对膜的变异系数、沉积速率、靶电流和工作电压有显著影响。此外，对使用确定的最佳工艺参数制备的样品进行了傅里叶变换红外光谱（FT-IR）、X射线衍射（XRD）和扫描电子显微镜（SEM）测试。此外，我们展示了提高实验可靠性的各种方法。研究结果表明，实现最佳结果的最有利工艺参数是工作压力0.065 Pa、溅射时间20分钟和溅射功率70 W。观察到溅射时间对铜锡合金膜的均匀性有显著影响，而溅射功率对其均匀性的影响最小。沉积速率主要受工作压力影响，观察到的影响最大。相反，溅射时间对沉积速率的影响最小。同样，靶电流主要受溅射功率影响，影响最大，而溅射时间对靶电流的影响最小。此外，工作电压受工作压力影响最显著，而溅射时间对工作电压的影响最小。
