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当代电子设备封装中的焊接与键合

Soldering and Bonding in Contemporary Electronic Device Packaging.

作者信息

Li Yuxuan, Pan Bei, Ge Zhenting, Chen Pengpeng, Bi Bo, Yi Xin, Wu Chaochao, Wang Ce

机构信息

Nanjing Electronic Devices Institute, Nanjing 210000, China.

School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou 350108, China.

出版信息

Materials (Basel). 2025 Apr 29;18(9):2015. doi: 10.3390/ma18092015.

DOI:10.3390/ma18092015
PMID:40363524
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC12072841/
Abstract

Electronic packaging can transform the chip to a device for assembly. Soldering and bonding are important procedures in the process of electronic packaging. The continuous development of packaging architecture has driven the emergence of improved soldering and bonding processes. At the same time, conventional soldering and bonding processes are still widely used in device packaging. This paper introduces two kinds of technologies in wafer bonding, direct and indirect, expounds on five kinds of die attachment processes, and also describes the process of ball bonding and wedge bonding in wire bonding in detail. Flip chip bonding and methods for making bumps are also described in depth. Bump bonding processes are vital for 3D-SiP packages, and the bonding technology of copper bumps is a research hotspot in the field of advanced packaging. The surface mount technology and sealing technology used in some electronic devices are also briefly introduced. This paper provides insights for researchers studying soldering and bonding in contemporary electronic device packaging.

摘要

电子封装可将芯片转变为便于组装的器件。焊接和键合是电子封装过程中的重要工序。封装架构的不断发展推动了改进型焊接和键合工艺的出现。与此同时，传统的焊接和键合工艺仍在器件封装中广泛应用。本文介绍了晶圆键合中的两种技术，即直接键合和间接键合，阐述了五种芯片贴装工艺，还详细描述了引线键合中的球形键合和楔形键合工艺。倒装芯片键合以及制作凸块的方法也进行了深入介绍。凸块键合工艺对3D-SiP封装至关重要，铜凸块的键合技术是先进封装领域的研究热点。本文还简要介绍了一些电子器件中使用的表面贴装技术和密封技术。本文为研究当代电子器件封装中焊接和键合的研究人员提供了见解。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/962b/12072841/17e490f4af4f/materials-18-02015-g012.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/962b/12072841/929aa5dcdefe/materials-18-02015-g001.jpg
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https://cdn.ncbi.nlm.nih.gov/pmc/blobs/962b/12072841/b79d7360f0a4/materials-18-02015-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/962b/12072841/915e36a19a11/materials-18-02015-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/962b/12072841/4f94e62bf2a9/materials-18-02015-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/962b/12072841/464aad131722/materials-18-02015-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/962b/12072841/e34ff7b9cce9/materials-18-02015-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/962b/12072841/2abf7a024436/materials-18-02015-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/962b/12072841/a587df2156fb/materials-18-02015-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/962b/12072841/75879d93f02e/materials-18-02015-g011.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/962b/12072841/17e490f4af4f/materials-18-02015-g012.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/962b/12072841/929aa5dcdefe/materials-18-02015-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/962b/12072841/5fe01b7fd908/materials-18-02015-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/962b/12072841/54f2a200d6d5/materials-18-02015-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/962b/12072841/b79d7360f0a4/materials-18-02015-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/962b/12072841/915e36a19a11/materials-18-02015-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/962b/12072841/4f94e62bf2a9/materials-18-02015-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/962b/12072841/464aad131722/materials-18-02015-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/962b/12072841/e34ff7b9cce9/materials-18-02015-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/962b/12072841/2abf7a024436/materials-18-02015-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/962b/12072841/a587df2156fb/materials-18-02015-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/962b/12072841/75879d93f02e/materials-18-02015-g011.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/962b/12072841/17e490f4af4f/materials-18-02015-g012.jpg

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Modern Trends in Microelectronics Packaging Reliability Testing.微电子封装可靠性测试的现代趋势
Micromachines (Basel). 2024 Mar 15;15(3):398. doi: 10.3390/mi15030398.
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A Review on Friction Stir Welding/Processing: Numerical Modeling.搅拌摩擦焊/加工综述：数值模拟
Materials (Basel). 2023 Aug 28;16(17):5890. doi: 10.3390/ma16175890.
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Copper Wire Bonding: A Review.铜丝键合：综述
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Research Progress on Bonding Wire for Microelectronic Packaging.微电子封装用键合线的研究进展
Micromachines (Basel). 2023 Feb 11;14(2):432. doi: 10.3390/mi14020432.
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Reliability issues of lead-free solder joints in electronic devices.电子设备中无铅焊点的可靠性问题。
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